IP Library Patent Application 14489632
Patent Application
App. No. 14/489,632

MOULDING COMPOUND BASED ON A PARTIALLY AROMATIC COPOLYAMIDE

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Patent No.
US None
App. No.
14/489,632
Abstract

A moulding composition, comprising at least 40 wt. % of the following components: a) 60 to 99 parts by wt. of a partially aromatic copolyamide which comprises as polymerized monomer units: I. 30 to 90 mol % of a combination of hexamethylenediamine and terephthalic acid; and II. 70 to 10 mol % of a lactam and/or of an ω-aminocarboxylic acid with 11 or 12 C atoms; and b) 40 to 1 parts by wt. of an olefinic copolymer comprising as polymerized monomer units: i) 35 to 94.9 wt. % of ethene-based monomer units, ii) 5 to 65 wt. % of monomer units based on a 1-alkene with 4 to 8 C atoms, iii) 0 to 10 wt. % of monomer units based on an olefin different from i) and ii), and iv) 0.1 to 2.5 wt. % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride, wherein a sum of the weight % values of i), ii), iii) and iv) is 100%, and the sum of the parts by wt. of a) and b) is 100; which can is processed into moulded articles with improved thermal aging resistance is provided.

Claims (40)

1 . A moulding composition, comprising at least 40 wt. % of the following components:

a) 60 to 99 parts by wt. of a partially aromatic copolyamide which comprises as polymerized monomer units:

I. 30 to 90 mol % of a combination of hexamethylenediamine and terephthalic acid; and

II. 70 to 10 mol % of a lactam and/or of an ω-aminocarboxylic acid with 11 or 12 C atoms,

wherein the mol % values relate to the sum of I and II and wherein at most 20% of the hexamethylenediamine can be replaced by the equivalent quantity of another diamine and/or wherein at most 20% of the terephthalic acid can be replaced by the equivalent quantity of another aromatic dicarboxylic acid and/or 1,4-cyclohexanedicarboxylic acid and/or wherein at most 20% of the repeating units of a lactam and/or of an ω-aminocarboxylic acid with 11 or 12 C atoms can be replaced respectively by the equivalent number of units which are derived from a combination of hexamethylenediamine and a linear aliphatic dicarboxylic acid with 8 to 19 C atoms and/or caprolactam;

b) 40 to 1 parts by wt. of an olefinic copolymer comprising as polymerized monomer units:

i) 35 to 94.9 wt. % of ethene-based monomer units,

ii) 5 to 65 wt. % of monomer units based on a 1-alkene with 4 to 8 C atoms,

iii) 0 to 10 wt. % of monomer units based on an olefin different from i) and ii), and

iv) 0.1 to 2.5 wt. % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride,

wherein

a sum of the weight % values of i), ii), iii) and iv) is 100%, and

the sum of the parts by wt. of a) and b) is 100.

2 . The moulding composition according to claim 1 ,

wherein a crystallite melting point T m of the copolyamide a) is from 240° C. to 300° C. when determined according to ISO 11357, measured during the 2nd heating stage.

3 . The moulding composition according to claim 1 ,

wherein a ratio of amino end groups to a sum of amino and carboxyl end groups of the partially aromatic copolyamide is from 0.3 to 0.7.

4 . The moulding moulding composition according to claim 1 ,

wherein the monomer unit iii) of the olefinic copolymer b) does not comprise an unconjugated diene.

5 . The moulding composition according to claim 1 ,

wherein the monomer unit iii) of the olefinic copolymer b) does not comprise styrene or propene.

6 . The moulding composition according to claim 1 , wherein

the olefinic copolymer consists of:

i) 35 to 94.9 wt. % of ethene-based monomer units,

ii) 5 to 65 wt. % of monomer units based on a 1-alkene with 4 to 8 C atoms, and

iv) 0.1 to 2.5 wt. % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride.

7 . The moulding composition according to claim 1 ,

wherein the 1-alkene with 4 to 8 C atoms ii) is at least one of 1-butene, 1-hexene and 1-octene.

8 . The moulding composition according to claim 1 , further comprising 0.01 to 60 wt. % of an additive selected from the group consisting of a stabilizer, a polymer different from a) and b), a fibrous reinforcing material, a filler, a plasticizer, a pigment, a colorant, a flame retardant and a processing aid.

9 . The moulding composition according to claim 8 ,

wherein the moulding composition comprises a stabilizer which is a copper-containing stabilizer.

10 . The moulding composition according to claim 9 , wherein the copper-containing stabilizer is a copper(I) salt in combination with an alkali metal halide.

11 . The moulding composition according to claim 10 , wherein the copper(I) salt is selected from the group consisting of copper acetate, copper stearate, copper acetylacetonate, and a copper halide.

12 . The moulding composition according to claim 10 , wherein the alkali metal halide is selected from the group consisting of iodides and bromides of lithium, sodium and potassium.

13 . The moulding composition according to claim 9 , wherein a copper content of the moulding composition is from 20 to 2000 ppm of copper.

14 . The moulding composition according to claim 8 ,

wherein the moulding composition comprises a stabilizer which is an oxidation stabilizer.

15 . A moulded article comprising the moulding composition of claim 1 .

16 . The moulded article according to claim 15 , wherein the moulded article is a monolayer pipe or a multilayer pipe.

17 . The moulded article according to claim 15 , wherein the moulded article is a monolayer container or a multilayer container.

Assignments (3)
CHANGE OF NAME Recorded Jan 31, 2020
From: EVONIK DEGUSSA GMBH
To: EVONIK OPERATIONS GMBH
Reel/Frame 051765/0166 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2015
From: EVONIK INDUSTRIES AG
To: EVONIK DEGUSSA GMBH
Reel/Frame 037174/0982 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2014
From: NITSCHE, JASMIN; HAEGER, HARALD; GEERKENS, SEBASTIAN; BAUMANN, FRANZ-ERICH; BEUTH, REINHARD
To: EVONIK INDUSTRIES AG
Reel/Frame 033968/0133 →