LED package structures for preventing lateral light leakage and method of manufacturing the same
An LED package structure for preventing lateral light leakage includes a substrate unit, a light-emitting unit, a light-transmitting unit and a light-shielding unit. The substrate unit includes a circuit substrate. The light-emitting unit includes at least one LED chip disposed on the circuit substrate and electrically connected to the circuit substrate. The light-transmitting unit includes a light-transmitting gel body disposed on the circuit substrate for enclosing the LED chip. The light-transmitting gel body has a first light-transmitting portion disposed on the circuit substrate for enclosing the LED chip and at least one second light-transmitting portion projected upwardly from the first light-transmitting portion and corresponding to the LED chip, and the second light-transmitting portion has a light output surface. The light-shielding unit includes a light-shielding gel body disposed on the circuit substrate for exposing the light output surface of the second light-transmitting portion.
1. An LED package structure for preventing lateral light leakage, comprising:
a substrate unit including a circuit substrate;
a light-emitting unit including at least one LED chip disposed on the circuit substrate and electrically connected to the circuit substrate;
a light-transmitting unit including a light-transmitting gel body disposed on the circuit substrate for enclosing the at least one LED chip, wherein the light-transmitting gel body has a first light-transmitting portion disposed on the circuit substrate for enclosing the at least one LED chip and at least one second light-transmitting portion projected upwardly from the first light-transmitting portion and corresponding to the at least one LED chip, and the at least one second light-transmitting portion has a light output surface and an outer perimeter surface connected between the light output surface and the first light-transmitting portion; and
a light-shielding unit including a light-shielding gel body disposed on the circuit substrate for exposing the light output surface of the at least one second light-transmitting portion, wherein the first light-transmitting portion and the outer perimeter surface of the at least one second light-transmitting portion are enclosed by the light-shielding gel body, and the light output surface of the at least one second light-transmitting portion is higher than, lower than or substantially flush with the top surface of the light-shielding gel body.
2. The LED package structure of claim 1 , wherein the first light-transmitting portion is a first column body disposed on the corresponding circuit substrate for enclosing the at least one LED chip of the corresponding light-emitting unit, the at least one second light-transmitting portion is a second column body integrally and upwardly projected from the first light-transmitting portion and disposed right above the at least one LED chip of the corresponding light-emitting unit, and the diameter of the at least one second light-transmitting portion is increased or decreased gradually along a direction from the first light-transmitting portion to the light output surface of the at least one second light-transmitting portion.
3. The LED package structure of claim 1 , wherein the circuit substrate has an outer perimeter, the light-shielding gel body has an outer perimeter, and the outer perimeter surface of the circuit substrate is substantially flush with the outer perimeter surface of the light-shielding gel body, wherein the light-transmitting gel body is formed by a transparent material only or by uniformly mixing the transparent material with phosphor particles and diffusion particles.