IP Library Granted Patent US 9,103,544
Granted Patent B2
US 9,103,544 · App. 14/490,243 · Granted Aug 11, 2015

Microchannel cooler for light emitting diode light fixtures

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Quick Facts
Patent No.
US 9,103,544
App. No.
14/490,243
Granted
Aug 11, 2015
Kind
B2
Abstract

A lighting module has an array of light emitters, a heat sink having a first surface, the array of light emitters being mounted to the first surface, a microchannel cooler arranged on a second surface of the heat sink on an opposite side of the heat sink from the first surface, the microchannel cooler arranged to transport a liquid through a channel on the second surface of the heat sink, and a cooling unit thermally coupled to a microchannel cooler and arranged to remove heat from the liquid.

Claims (29)

1. A lighting system, comprising:

an array of light emitters, arranged on a first surface of a substrate;

one or more microchannel coolers mounted behind the array on an opposite side of the substrate, the one or more microchannel coolers including an input port to allow a liquid to enter the one or more microchannel coolers and flow through microchannels in the one or more microchannel coolers, and an output port to exhaust the liquid after flowing through the microchannels in the one or more microchannel coolers, the one or more microchannel coolers comprising a plurality of plates arranged in a stack;

a microchannel cooler manifold attached to the opposite side of the one or more microchannel coolers;

at least one fan; and

one or more radiators receiving exhausted liquid from the microchannel cooler manifold.

2. The lighting system of claim 1 , wherein the array of light emitters includes a plurality of arrays of light emitters positioned forward of the substrate.

3. The lighting system of claim 2 , wherein the plurality of arrays is mounted directly to the first surface of the substrate.

4. The system of claim 1 , wherein the array of light emitters comprises at least a plurality of rows and a plurality of columns of light-emitting diodes.

5. The system of claim 1 , wherein the plates comprise copper.

6. The system of claim 1 , wherein the plates are etched, laser machined or patterned with one or more features aligned to form the microchannels with the plates stacked.

7. The system of claim 1 , wherein the liquid from a plurality of the one or more microchannel coolers travels in parallel with one another through the microchannel cooler manifold to the one or more radiators.

8. The system of claim 7 , wherein the at least one fan is positioned perpendicular to the substrate.

9. The system of claim 1 , wherein the input port and output port of each of the one or more microchannel coolers are mounted perpendicularly to a plane of a respective microchannel cooler surface that is facing away from the light emitters.

10. The system of claim 1 , wherein the microchannel cooler manifold is positioned between the one or more microchannel coolers and the one or more radiators.

11. The system of claim 1 , wherein the microchannel cooler manifold comprises input and output passages through which liquid enters and exits.

12. A lighting system, comprising:

an array of light emitters, arranged on a first surface of a substrate;

one or more microchannel coolers mounted behind the array on an opposite side of the substrate, the one or more microchannel coolers including an input port to allow a liquid to enter the one or more microchannel coolers and flow through microchannels in the one or more microchannel coolers, and an output port to exhaust the liquid after flowing through the microchannels in the one or more microchannel coolers, the one or more microchannel coolers comprising a plurality of plates arranged in a stack;

a microchannel cooler manifold attached to the opposite side of the one or more microchannel coolers;

at least one fan; and

one or more radiators receiving exhausted liquid from the microchannel cooler manifold, wherein the plates are etched, laser machined or patterened with one or more features aligned to form the microchannels with the plates stacked, and wherein the input port and output port of each of the one or more microchannel coolers are mounted perpendicularly to a plane of a respective microchannel cooler surface that is facing away from the light emitters.

13. The lighting system of claim 12 wherein the array of light emitters includes a plurality of arrays of light emitters positioned forward of the substrate.

14. The lighting system of claim 13 wherein the plurality of arrays is mounted directly to the first surface of the substrate.

15. The system of claim 12 , wherein the light emitters comprises at least a plurality of rows and a plurality of columns of light-emitting diodes, and wherein the plates comprise copper.

16. The system of claim 12 , wherein the liquid from a plurality of the one or more microchannel coolers travels in parallel with one another through the microchannel cooler manifold to the one or more radiators.

17. The system of claim 16 , wherein the at least one fan is positioned perpendicular to the substrate.

18. The system of claim 12 , wherein the microchannel cooler manifold is positioned between the one or more microchannel coolers and the one or more radiators.

19. The system of claim 12 , wherein the microchannel cooler manifold comprises input and output passages through which liquid enters and exits.

Assignments (4)
MERGER Recorded Apr 18, 2024
From: PHOSEON TECHNOLOGY, INC.
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 067162/0245 →
RELEASE OF SECURITY INTEREST Recorded Feb 8, 2023
From: SILICON VALLEY BANK
To: PHOSEON TECHNOLOGY, INC.
Reel/Frame 062687/0618 →
SECURITY INTEREST Recorded Jan 13, 2017
From: PHOSEON TECHNOLOGY, INC.
To: SILICON VALLEY BANK
Reel/Frame 041365/0727 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2014
From: IGL, SCOTT; MOLAMPHY, THOMAS
To: PHOSEON TECHNOLOGY, INC.
Reel/Frame 033831/0948 →