Method to fabricate micro and nano diamond devices
View Patent ↗A method including forming a diamond material on the surface of a substrate; forming a first contact and a separate second contact; and patterning the diamond material to form a nanowire between the first contact and the second contact. An apparatus including a first contact and a separate second contact on a substrate; and a nanowire including a single crystalline or polycrystalline diamond material on the substrate and connected to each of the first contact and the second contact.
1. An apparatus comprising:
a first contact and a separate second contact on a substrate; and
a nanowire disposed between a first contact pad and a second contact pad, the nanowire and the first contact pad and the second contact pad comprising a single crystalline or polycrystalline diamond material patterned from a layer of the diamond material on the substrate, wherein the first contact is disposed on the first contact pad and the second contact is disposed on the second contact pad, wherein the nanowire comprises a trapezoidal shape.
2. The apparatus of claim 1 , wherein a diameter of the nanowire is 400 nanometers or less.
3. The apparatus of claim 1 , wherein the first contact and the second contact are disposed on diamond material.
4. The apparatus of claim 1 , wherein the nanowire is connected to the diamond material on which the first contact and the second contact are disposed.
5. The apparatus of claim 1 , wherein the substrate comprises a semiconductor material.
6. The apparatus of claim 1 , wherein the substrate comprises a dielectric material.
7. The apparatus of claim 1 , wherein the first contact and the second contact are each disposed on contact pads patterned from the layer of the diamond material.
8. The apparatus of claim 1 , wherein the nanowire comprises polycrystalline diamond material.
9. The apparatus of claim 1 further comprising a gate electrode disposed on the nanowire.
10. The apparatus of claim 1 , wherein the first contact pad and the second contact pad is each larger than the respective first contact and the second contact.