IP Library › Granted Patent US 9,301,393
Granted Patent B2
US 9,301,393 · App. 14/492,858 · Granted Mar 29, 2016

System and method for a high retention module interface

Inventors: Andrew T. Sultenfuss (Leander, TX); Thomas G. Noonan (Round Rock, TX)
Assignee: DELL PRODUCTS, LP
H05K1/11H01L23/562H01Q1/12H05K1/0213H05K7/14H05K13/0023H01L2224/11H01L2924/0002Y10T29/49016
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Quick Facts
Patent No.
US 9,301,393
App. No.
14/492,858
Granted
Mar 29, 2016
Kind
B2
Abstract

A device includes a substrate, a first antenna connection, and a first retention mechanism. The substrate has a top surface and a bottom surface. The first antenna connection is mounted directly to the top surface of the substrate, and is configured to connect with a first antenna. The first retention mechanism is connected at a first location of the bottom surface of the substrate to provide support for the substrate at the first antenna connection when the first antenna connection is connected to the first antenna. The first location of the first retention mechanism is selected to be directly below the first antenna connection.

Claims (43)

1. A device comprising:

a substrate having a top surface and a bottom surface;

a plurality of solder tabs connected to the bottom surface of the substrate, wherein the solder tabs are configured to provide support to the substrate;

a first antenna connection mounted directly to the top surface of the substrate, wherein the first antenna connection is configured to connect with a first antenna; and

a first retention mechanism connected at a first location of the bottom surface of the substrate to provide support for the substrate at the first antenna connection when the first antenna connection is connected to the first antenna, wherein the first location of the first retention mechanism is directly below the first antenna connection.

2. The device of claim 1 further comprising:

a second antenna connection mounted directly to the top surface of the substrate, wherein the second antenna connection is configured to connect with a second antenna; and

a second retention mechanism connected to a second location of the bottom surface of the substrate to provide support for the substrate when the second antenna connection is connected to the second antenna, wherein the second location of the second retention mechanism is selected to be directly below the second antenna connection.

3. The device of claim 1 further comprising:

a second antenna connection mounted directly to the top surface of the substrate, wherein the second antenna connection is configured to connect with a second antenna wherein the first location of the first retention mechanism is selected to be directly below the second antenna connection.

4. The device of claim 3 wherein the first retention is rectangular and extends along the bottom surface of the substrate for a substantially similar distance as a distance of the first antenna connection to the second antenna connection on the top surface of the substrate.

5. The device of claim 1 wherein the first retention mechanism is shaped as an outline of the first antenna connection.

6. The device of claim 1 wherein the first retention mechanism is configured to provide a ground potential for the device.

7. The device of claim 1 wherein the device is configured to provide a primary radio for a wireless device via the first antenna connection and the first antenna.

8. A device comprising:

a printed circuit board;

a substrate having a top surface and a bottom surface;

a plurality of solder tabs connected to the bottom surface of the substrate, wherein the solder tabs are configured to connect the substrate to the printed circuit board and to provide support to the substrate, and wherein the solder tabs are evenly distributed on the bottom surface of the substrate;

a first antenna connection mounted directly to a first location of the top surface of the substrate, wherein the first antenna connection is configured to connect with a first antenna; and

a first retention mechanism connected at a second location of the bottom surface of the substrate to provide support for the substrate at the first antenna connection when the first antenna connection is connected to the first antenna, wherein the first location of the first retention mechanism is directly below the first antenna connection.

9. The device of claim 8 further comprising:

a second antenna connection mounted directly to the top surface of the substrate, wherein the second antenna connection is configured to connect with a second antenna; and

a second retention mechanism connected to a second location of the bottom surface of the substrate to provide support for the substrate when the second antenna connection is connected to the second antenna, wherein the second location of the second retention mechanism is selected to be directly below the second antenna connection.

10. The device of claim 8 further comprising:

a second antenna connection mounted directly to the top surface of the substrate, wherein the second antenna connection is configured to connect with a second antenna wherein the first location of the first retention mechanism is selected to be directly below the second antenna connection.

11. The device of claim 10 wherein the first retention is rectangular and extends along the bottom surface of the substrate for a substantially similar distance as a distance of the first antenna connection to the second antenna connection on the top surface of the substrate.

12. The device of claim 8 wherein the first retention mechanism is a crescent shape directly on the opposite side of the substrate as the first antenna connection.

13. The device of claim 8 wherein a stress exerted when the first antenna is connected to the first antenna contention is greater than a normal flex stress on the substrate.

14. The device of claim 8 wherein the device is configured to provide a primary radio for a wireless device via the first antenna connection and the first antenna.

15. A method comprising:

attaching a first antenna connection to a top surface of a substrate at a first location of the top surface;

attaching a plurality of solder tabs to a bottom surface of the substrate, wherein the solder tabs are configured to connect the substrate to a printed circuit board and to provide support to of the substrate, and wherein the solder tabs are evenly distributed on the bottom surface of the substrate;

determining a second location on a bottom surface of the substrate for a first retention mechanism based on the first location of the first antenna connection, wherein the second location is directly below the first antenna connection; and

attaching the first retention mechanism to the bottom surface of the substrate at the second location of the bottom surface, wherein the first retention mechanism is configured to provide support for the substrate at the first location when the first antenna connection is connected to a first antenna.

16. The method of claim 15 father comprising:

attaching a second antenna connection to the top surface of a substrate at a third location of the top surface, wherein the second location of the first retention mechanism on the bottom surface is directly below the third location of the second antenna connection.

17. The method of claim 15 wherein the substrate is a portion of a module configured to provide a primary radio for a wireless device via the first antenna connection and the first antenna.

18. The method of claim 15 further comprising:

attaching a second antenna connection to the top surface of a substrate at a third location of the top surface;

determining a fourth location on the bottom surface of the substrate for a second retention mechanism based on the third location of the second antenna connection, wherein the fourth location is directly below the second antenna connection; and

attaching the second retention mechanism to the bottom surface of the substrate at the fourth location on the bottom surface, wherein the second retention mechanism is configured to provide support for the substrate when the second antenna connection is connected to a second antenna.

19. The method of claim 15 wherein a stress exerted when the first antenna is connected to the first antenna contention is greater than a normal flex stress on the substrate.

20. The method of claim 15 wherein the first retention mechanism is a star burst shape.

Assignments (14)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
RELEASE OF REEL 034591 FRAME 0391 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0719 →
RELEASE OF REEL 034590 FRAME 0731 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0070 →
RELEASE OF REEL 034590 FRAME 0696 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040016/0964 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 034591/0391 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 034590/0731 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 034590/0696 →
Continuity (2)
Continuation 13219237 · Aug 26, 2011
Related Publication 20150009643A1 · Jan 8, 2015