Method for producing a substrate for organic electronic devices
Provided are methods of manufacturing a substrate for an OED and an OED. According to the methods of manufacturing a substrate for forming an OED such as an OLED and an OED, a substrate for forming a device having excellent light extraction efficiency and improved reliability by preventing penetration of moisture or air into the device, or device using the same may be provided.
1. A method of manufacturing a substrate for an organic electronic device, comprising processing an optical functional layer on a base layer with a laser so as to have a smaller projected area than the base layer,
wherein the optical functional layer comprises a scattering layer and a planarized layer formed on the scattering layer,
wherein both the scattering layer and the planarized layer are processed by the laser,
wherein the scattering layer is a layer comprising an uneven structure, and
wherein the planarized layer comprises a binder and a high refractive index particle.
2. The method according to claim 1 , wherein the scattering layer is a layer comprising a scattering particle.
3. The method according to claim 1 , wherein the optical functional layer is formed on the base layer by a wet coating, sol-gel, deposition, or microembossing method.
4. The method according to claim 1 , wherein the processing is performed by irradiating a laser toward the optical functional layer or the base layer.
5. The method according to claim 1 , wherein the processing is performed by irradiating a spot laser or a line beam laser.
6. The method according to claim 1 , further comprising forming an electrode layer on the processed optical functional layer to have a larger projected area than the optical functional layer.
7. The method according to claim 6 , wherein the electrode layer is formed to have a ratio (A/B) of a projected area (A) of the electrode layer and a projected area (B) of the optical functional layer of 1.04 or more.
8. A method of manufacturing an organic electronic device, comprising: sequentially forming an organic layer comprising an emitting layer and a second electrode layer on an optical functional layer of the substrate formed in claim 1 .
9. The method according to claim 8 , further comprising: forming a first electrode layer having a larger projected area than the optical functional layer before forming the organic layer on the substrate.
10. The method according to claim 9 , wherein the first electrode layer is formed to have a ratio (A/B) of a projected area (A) of the first electrode layer and a projected area (B) of the optical functional layer of 1.04 or more.
11. The method according to claim 9 , further comprising forming an encapsulating structure after the second electrode layer is formed.
12. The method according to claim 11 , wherein the encapsulating structure is formed on the base layer in contact with the first electrode layer below which the optical functional layer is not formed.