IP Library Granted Patent US 9,318,510
Granted Patent B2
US 9,318,510 · App. 14/493,241 · Granted Apr 19, 2016

Metal wire, thin-film transistor substrate and method for manufacturing a thin-film transistor substrate

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Quick Facts
Patent No.
US 9,318,510
App. No.
14/493,241
Granted
Apr 19, 2016
Kind
B2
Abstract

A metal wire included in a display device, the metal wire includes a first metal layer including a nickel-chromium alloy, a first transparent oxide layer disposed on the first metal layer, and a second metal layer disposed on the first transparent oxide layer.

Claims (39)

1. A metal wire included in a display device, the metal wire comprising:

a first metal layer including a nickel-chromium alloy;

a first transparent oxide layer disposed on the first metal layer;

a second metal layer disposed on the first transparent oxide layer, and

a second transparent oxide layer disposed on the second metal layer.

2. The metal wire of claim 1 ,

wherein the first metal layer further includes at least one selected from the group consisting of vanadium (V), titanium (Ti), zirconium (Zr), aluminum (Al), iron (Fe), Indium (In), tantalum (Ta), manganese (Mn), magnesium (Mg), molybdenum (Mo), cobalt (Co), tin (Sn), tungsten (W), niobium (Nb), and neodymium (Nd).

3. The metal wire of claim 1 ,

wherein a thickness of the first metal layer is about 80 Å to about 300 Å.

4. The metal wire of claim 1 ,

wherein the first transparent oxide layer includes at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), gallium zinc oxide (GZO), zinc aluminum oxide (ZAO), titanium oxide (TiO), aluminium oxide (AlO), aluminium zinc tin oxide (AZTO), indium gallium zinc oxide (IGZO), indium oxide (InO), titanium indium zinc oxide (TIZO), and hafnium indium zinc oxide (HIZO).

5. The metal wire of claim 1 ,

wherein a thickness of the first transparent oxide layer is about 400 Å to about 500 Å.

6. The metal wire of claim 1 ,

wherein the second metal layer includes at least one selected from the group consisting of copper (Cu), chromium (Cr), titanium (Ti), aluminum (Al), molybdenum (Mo), silver (Ag), and gold (Au).

7. A thin-film transistor substrate comprising:

a base substrate;

a gate pattern on the base substrate, the gate pattern including a gate line, and a gate electrode coupled to the gate line;

a semiconductor pattern on the gate electrode; and

a source pattern including a data line crossing the gate line, a source electrode overlapping the semiconductor pattern and coupled to the data line, and a drain electrode overlapping the semiconductor pattern and spaced apart from the source electrode,

wherein at least one of the gate pattern and the source pattern includes:

a first metal layer including a nickel-chromium alloy;

a first transparent oxide layer disposed on the first metal layer;

a second metal layer disposed on the first transparent oxide layer, and

a second transparent oxide layer disposed on the second metal layer.

8. The thin-film transistor substrate of claim 7 ,

wherein the first metal layer further includes at least one selected from the group consisting of vanadium (V), titanium (Ti), zirconium (Zr), aluminum (Al), iron (Fe), Indium (In), tantalum (Ta), manganese (Mn), magnesium (Mg), molybdenum (Mo), cobalt (Co), tin (Sn), tungsten (W), niobium (Nb), and neodymium (Nd).

9. The thin-film transistor substrate of claim 7 ,

wherein a thickness of the first metal layer is about 80 Å to about 300 Å.

10. The thin-film transistor substrate of claim 7 ,

wherein the first transparent oxide layer includes at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), gallium zinc oxide (GZO), zinc aluminum oxide (ZAO), titanium oxide (TiO), aluminium oxide (AlO), aluminium zinc tin oxide (AZTO), indium gallium zinc oxide (IGZO), indium oxide (InO), titanium indium zinc oxide (TIZO), and hafnium indium zinc oxide (HIZO).

11. The thin-film transistor substrate of claim 7 ,

wherein a thickness of the first transparent oxide layer is about 400 Å to about 500 Å.

12. The thin-film transistor substrate of claim 7 ,

wherein the second metal layer includes at least one selected from the group consisting of copper (Cu), chromium (Cr), titanium (Ti), aluminum (Al), molybdenum (Mo), silver (Ag), and gold (Au).

13. The thin-film transistor substrate of claim 7 ,

wherein the second transparent oxide layer includes at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), gallium zinc oxide (GZO), zinc aluminum oxide (ZAO), titanium oxide (TiO), aluminum oxide (AlO), aluminum zinc tin oxide (AZTO), indium gallium zinc oxide (IGZO), indium oxide (InO), titanium indium zinc oxide (TIZO), and hafnium indium zinc oxide (HIZO).

14. The thin-film transistor substrate of claim 7 ,

wherein the semiconductor pattern includes a semiconductor layer including an oxide semiconductor or amorphous silicon.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: SAMSUNG DISPLAY CO., LTD.
To: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 060778/0543 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2014
From: KIM, KYUNG-SEOP; KIM, BYEONG-BEOM; SHIN, SANG-WON; LEE, DAE-YOUNG; JEONG, CHANG-OH; PARK, JOON-YONG; LEE, DONG-MIN
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 033906/0376 →