Solar cell having a rear side metallization
View Patent ↗Various embodiments provide a solar cell. The solar cell includes a substrate having a front side and a rear side. At least the front side receives light. The solar cell further includes a multiplicity of rear side solder pad regions at least partially arranged over the rear side, and a plurality of partial solder pads formed in each rear side solder pad region of the multiplicity of rear side solder pad regions. Each partial solder pad includes a first metal. The partial solder pads in a respective rear side solder pad region are separated from each other. The solar cell further includes a rear side metallization formed at the rear side of the substrate partly overlapping the partial solder pads, the rear side metallization including a second metal different from the first metal.
1. A solar cell, comprising:
a substrate comprising a front side and a rear side, wherein at least the front side receives light;
a plurality of rear side solder pad regions at least partially arranged over the rear side,
wherein at least one first dielectric layer separates adjacent rear side solder pad regions by a first distance;
a plurality of partial solder pads formed in each rear side solder pad region of the plurality of rear side solder pad regions, wherein at least one second dielectric layer separates adjacent partial solder pads within each rear side solder pad region by a second distance such that the plurality of partial solder pads and at least one second dielectric layer within each rear side solder pad region are disposed in an alternating manner in a direction along the rear surface,
wherein the first distance is greater than the second distance,
wherein each partial solder pad comprises a first metal, and
a rear side metallization formed at the rear side of the substrate partly overlapping the partial solder pads, the rear side metallization comprising a second metal different from the first metal,
wherein at least one of the partial solder pads in each rear side solder pad region extends at least substantially from the rear side of the substrate to the rear side metallization.
2. The solar cell of claim 1 ,
wherein each rear side solder pad region of the plurality of rear side solder pad regions has a covered surface area greater than 10 mm 2 .
3. The solar cell of claim 1 ,
wherein the first distance is in the range from about 2 mm to about 20 mm.
4. The solar cell of claim 1 ,
wherein the second distance is in the range from about 0.1 mm to about 1.0 mm.
5. The solar cell of claim 1 ,
wherein a maximum overlap of the second metal on the first metal is 0.3 mm.
6. The solar cell of claim 1 ,
wherein at least two rows of partial solder pads are formed in each rear side solder pad region of the plurality of rear side solder pad regions.
7. The solar cell of claim 6 ,
wherein at least four partial solder pads are formed in each rear side solder pad region of the plurality of rear side solder pad regions.
8. The solar cell of claim 1 ,
wherein the partial solder pads have a round shape with a diameter in the range from about 1.5 mm to about 4 mm.
9. The solar cell of claim 8 ,
wherein the partial solder pads are O-ring shaped and have inner diameter of at least 0.5 mm.
10. The solar cell of claim 1 ,
wherein the plurality of rear side solder pad regions are arranged in a plurality of columns and a plurality of rows over the rear side of the substrate.
11. The solar cell of claim 6 ,
wherein the partial solder pads of a first row are arranged offset to a second row.
12. The solar cell of claim 1 ,
wherein the first metal comprises silver or nickel and the second metal comprises aluminum.
13. A solar cell, comprising:
a substrate comprising a front side and a rear side, wherein at least the front side receives light;
a plurality of rear side solder pad regions at least partially arranged over the rear side,
wherein at least one first dielectric layer separates adjacent rear side solder pad regions by a first distance,
a plurality of partial solder pads formed within each rear side solder pad region of the plurality of rear side solder pad regions, wherein at least one second dielectric layer separates adjacent partial solder pads within each rear side solder pad region by a second distance such that the plurality of partial solder pads and at least one second dielectric layer within each rear side solder pad region are disposed in an alternating manner in a direction along the rear surface,
wherein the first distance is greater than the second distance,
wherein each partial solder pad comprises a first metal;
a rear side metallization formed at the rear side of the substrate partly overlapping the partial solder pads, the rear side metallization comprising a second metal different from the first metal, wherein at least one of the partial solder pads in each rear side solder pad region extends at least substantially from the rear side of the substrate to the rear side metallization, wherein the rear side metallization penetrates through the dielectric layer to contact the at least one of the partial solder pads.
14. The solar cell of claim 13 ,
wherein the first distance is in the range from about 2 mm to about 20 mm.
15. The solar cell of claim 13 ,
wherein the second distance is in the range from about 0.1 mm to about 1.0 mm.
16. The solar cell of claim 13 ,
wherein a maximum overlap of the second metal on the first metal is 0.3 mm.