This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.
1. An LED assembly, comprising:
a transparent substrate;
a first phosphor layer;
a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount;
an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches;
a second phosphor layer covering a topmost of the LED and filled inside the plurality of trenches; and
an electrode plate arranged on an edge of the transparent mount.
2. The LED assembly as claimed in claim 1 , wherein one of the trenches has a bottom apart from the first phosphor layer by a predetermined distance.
3. The LED assembly as claimed in claim 2 , wherein the predetermined distance is not more than 150 μm.
4. The LED assembly as claimed in claim 1 , wherein the second phosphor layer contacts the first phosphor layer via the trenches.
5. The LED assembly as claimed in claim 1 , wherein the second phosphor layer fills up the trenches.
6. The LED assembly as claimed in claim 1 , further comprising an interconnection circuit on the transparent mount.
7. The LED assembly as claimed in claim 6 , wherein the interconnection circuit is a printed circuit and the LED chip is flipped over to mount on the printed circuit.
8. The LED assembly as claimed in claim 6 , wherein the interconnection circuit comprises a bonding wire.
9. The LED assembly as claimed in claim 6 , wherein the second phosphor layer covers the interconnection circuit.
10. The LED assembly as claimed in claim 1 , wherein the second phosphor layer covers the LED chip.
11. The LED assembly as claimed in claim 1 , wherein the LED chip comprises a plurality of LED cells on a common substrate.
12. The LED assembly as claimed in claim 1 , wherein the transparent mount further comprises a mounting trench for mounting the LED chip thereon.
13. The LED assembly as claimed in claim 12 , wherein the mounting trench is arranged between the trenches.
14. The LED assembly as claimed in claim 1 , wherein the conductive electrode plate is substantially devoid of the second phosphor layer.
15. The LED assembly as claimed in claim 1 , wherein the transparent mount comprises a portion arranged between two of the plurality of trenches and having a width greater than that of the LED chip.
16. The LED assembly as claimed in claim 1 , wherein the transparent mount has a width substantially the same with that of the transparent substrate.
17. An LED assembly, comprising:
a transparent substrate;
a first phosphor layer;
a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount;
an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches;
a second phosphor layer arranged inside the trenches, and having a top surface coplanar with the transparent mount ; and
a third phosphor layer covering a topmost of the LED chip.
18. The LED assembly as claimed in claim 17 , wherein the third phosphor is not extended beyond the second phosphor.