Semiconductor manufacturing apparatus

1. In combination with a lead frame on which a semiconductor chip is mounted, a semiconductor device manufacturing apparatus for encapsulating the semiconductor chip with a resin, the semiconductor device manufacturing apparatus comprising:

an upper mold and a lower mold between which the lead frame is mounted;

a tapered positioning pin provided to the lower mold, the tapered positioning pin including a columnar portion having an outer diameter larger than an inner diameter of a positioning hole provided at an upper surface of the lead frame and configured to receive the columnar portion of the tapered positioning pin; and

a plurality of ejector pins disposed in proximity to the tapered positioning pin at a distance determined by a thickness of the lead frame, the plurality of ejector pins being arranged so as to be symmetrical with respect to the tapered positioning pin.

2. A combination according to claim 1 , wherein the outer diameter of the columnar portion of the tapered positioning pin is smaller than an inner diameter of a positioning hole at a lower surface of the lead frame.

3. A combination according to claim 2 , wherein an angle formed by slants of the positioning hole in sectional view at the lower surface of the lead frame is the same as an angle formed by slants of a conical portion of the tapered positioning pin in sectional view.

4. In combination with a lead frame on which a semiconductor chip is mounted, a semiconductor device manufacturing apparatus for encapsulating the semiconductor chip with a resin, the semiconductor device manufacturing apparatus comprising:

an upper mold and a lower mold between which the lead frame is mounted;

a tapered positioning pin provided to the lower mold, the tapered positioning pin including a columnar portion having an outer diameter larger than an inner diameter of a positioning hole provided at an upper surface of the lead frame and configured to receive the columnar portion of the tapered positioning pin; and

an ejector pin in a pair with the tapered positioning pin, the ejector pin being provided at a distance from the tapered positioning pin, the distance being determined by a thickness of the lead frame;

wherein when the lead frame has a thickness of 80 μm or more, the tapered positioning pin and the ejector pin are arranged at a distance of 1.5 mm or less from each other.

5. In combination with a lead frame on which a semiconductor chip is mounted, a semiconductor device manufacturing apparatus for encapsulating the semiconductor chip with a resin, the semiconductor device manufacturing apparatus comprising:

an upper mold and a lower mold between which the lead frame is mounted;

a tapered positioning pin provided to the lower mold, the tapered positioning pin including a columnar portion having an outer diameter larger than an inner diameter of a positioning hole provided at an upper surface of the lead frame and configured to receive the columnar portion of the tapered positioning pin; and

an ejector pin in a pair with the tapered positioning pin, the ejector pin being provided at a distance from the tapered positioning pin, the distance being determined by a thickness of the lead frame;

wherein the tapered positioning pin and the ejector pin are arranged at a distance of 1.0 mm or less from each other when the lead frame has a thickness of 50 μm or more and less than 80 μm.

6. A combination according to claim 1 , further comprising a positioning pin rotation mechanism at a bottom portion of the tapered positioning pin.

7. In combination with a lead frame on which a semiconductor chip is mounted, a semiconductor device manufacturing apparatus for encapsulating the semiconductor chip with a resin, the semiconductor device manufacturing apparatus comprising:

an upper mold and a lower mold between which the lead frame is mounted;

a tapered positioning pin provided to the lower mold, the tapered positioning pin including a columnar portion having an outer diameter larger than an inner diameter of a positioning hole provided at an upper surface of the lead frame and configured to receive the columnar portion of the tapered positioning pin; and

an ejector pin provided at a distance from the tapered positioning pin, the distance being determined by a thickness of the lead frame;

wherein the positioning hole of the lead frame and the tapered positioning pin are held in point contact with each other at a plurality of contact points in plan view.

8. A combination according to claim 7 , wherein the positioning pin has an oval shape in plan view.

9. A combination according to claim 7 , wherein the positioning hole has a regular polygonal shape in plan view.

10. A combination according to claim 9 , wherein a number of vertices of the regular polygonal shape is three to eight.

11. A combination according to claim 1 , further comprising another tapered positioning pin provided to the upper mold; and wherein the plurality of ejector pins comprises a first pair of ejector pins disposed in proximity to and arranged so as to be symmetrical with the tapered positioning pin provided to the lower mold, and a second pair of ejector pins disposed in proximity to and arranged so as to be symmetrical with the tapered positioning pin provided to the upper mold.

12. A combination according to claim 4 , further comprising another tapered positioning pin provided to the upper mold, and another ejector pin provided in a pair with the another tapered positioning pin, the another ejector pin being provided at a distance from the another tapered positioning pin.

13. A combination according to claim 5 , further comprising another tapered positioning pin provided to the upper mold, and another ejector pin provided in a pair with the another tapered positioning pin, the another ejector pin being provided at a distance from the another tapered positioning pin.