Cable connection structure, ultrasonic probe, and ultrasonic endoscope system
A cable connection structure for connecting a plurality of cables to an electrode provided on a substrate includes an extended portion that is provided integrally with the plurality of cables, extends from the plurality of cables, and covers at least a connection part between the plurality of cables and the electrode.
1. A cable connection structure comprising:
a first substrate formed of a bendable electrically insulating film;
a plurality of lead terminals that are disposed next to one another along a first direction on the first substrate and projected from an edge portion of the first substrate along a second direction, the second direction being different from the first direction;
a second substrate having a first surface on which a plurality of electrodes are provided, wherein the plurality of lead terminals are electrically connected to corresponding electrodes of the plurality of electrodes;
an extended portion that extends from the first substrate along the first direction, and covers the plurality of lead terminals and the plurality of electrodes; and
an adhesive for joining the extended portion to the second substrate.
2. The cable connection structure according to claim 1 , wherein the first substrate includes a bended portion at which the extended portion is bent, and when bent, the extended portion covers the plurality of lead terminals and the plurality of electrodes, the bended portion extending along the second direction.
3. The cable connection structure according to claim 2 , wherein the extended portion extends beyond a lead terminal disposed farthermost from the bended portion among the plurality of the lead terminals.
4. The cable connection structure according to claim 1 , wherein the extended portion has a length along the second direction, the length being greater than a distance between the edge portion of the first substrate and distal end portions of the plurality of electrodes along the second direction.
5. The cable connection structure according to claim 1 , wherein the second substrate is formed of one of a semiconductor and a glass epoxy.
6. The cable connection structure according to claim 1 , wherein the first substrate further includes an additional extended portion that extends from the first substrate and covers a second surface of the second substrate, the second surface being opposed to the first surface.
7. The cable connection structure according to claim 1 , wherein the second direction is perpendicular to the first direction.
8. The cable connection structure according to claim 1 , wherein the plurality of lead terminals are formed of copper.
9. The cable connection structure according to claim 8 , wherein surfaces of the plurality of lead terminals are coated with one of nickel and gold.
10. The cable connection structure according to claim 1 , wherein the extended portion is provided on an outer surface with a ground electrode to be grounded, the outer surface being opposed to an inner surface facing the first substrate.
11. The cable connection structure according to claim 1 , wherein at least one of the first substrate and the extended portion are provided with a ground electrode.