ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM FOR CONTROLLED SUBSTRATE DEPTH
A roll-to-roll electroless plating system for controlled substrate depth includes electroless plating solution disposed within an electroless plating bath, a conveyor system configured to convey a roll-to-roll substrate material through the electroless plating solution, a first depth setting roller disposed at an entry location of the roll-to-roll substrate material to the electroless plating solution, and a second depth setting roller disposed at an exit location of the roll-to-roll substrate material from the electroless plating solution. A diameter of the first and the second depth setting rollers is selected to dispose the roll-to-roll substrate material at a predetermined depth of the electroless plating solution.
1 . A roll-to-roll electroless plating system for controlled substrate depth comprising:
electroless plating solution disposed within an electroless plating bath;
a conveyor system configured to convey a roll-to-roll substrate material through the electroless plating solution;
a first depth setting roller disposed at an entry location of the roll-to-roll substrate material to the electroless plating solution;
a second depth setting roller disposed at an exit location of the roll-to-roll substrate material from the electroless plating solution,
wherein a diameter of the first and the second depth setting rollers is selected to dispose the roll-to-roll substrate material at a predetermined depth of the electroless plating solution.
2 . The system of claim 1 , further comprising;
a cover disposed between the first depth setting roller and the second depth setting roller, wherein the cover covers at least a portion of an exposed surface area of the electroless plating solution.
3 . The system of claim 1 , further comprising:
a plurality of wheels disposed within the electroless plating bath, wherein the plurality of wheels assist conveyance of the roll-to-roll substrate material while submerged at the predetermined depth.
4 . The system of claim 1 , wherein the depth setting roller comprises:
a cylindrical sleeve having a radius greater than the predetermined depth;
a cylindrical cover disposed within a distal end of the cylindrical sleeve, wherein the cylindrical cover comprises a plug hole disposed at a center of the cylindrical cover;
a plug disposed within the plug hole, wherein the plug comprises a pin hole disposed at a center of the plug;
a spring disposed within the pin hole; and
an axial pin partially disposed within the pin hole.
5 . The system of claim 1 , wherein the depth setting roller comprises a material resistant to electroless plating.
6 . The system of claim 1 , wherein the first depth setting roller and the second depth setting roller are removable.
7 . The system of claim 1 , wherein the predetermined depth may be controlled by a diameter of the first depth setting roller and the second depth setting roller.
8 . The system of claim 1 , wherein the predetermined depth is in a range between approximately 2 inches and approximately 3 inches.
9 . The system of claim 1 , wherein the first depth setting roller and the second depth setting roller are not driven.
10 . The system of claim 1 , wherein the first depth setting roller and the second depth setting roller are driven with a motor.
11 . A method of controlling a submerged depth of a roll-to-roll substrate material comprising:
disposing a first depth setting roller at an entry location of the roll-to-roll substrate material to an electroless plating solution disposed in an electroless plating bath;
disposing a second depth setting roller at an exit location of the roll-to-roll substrate material from the electroless plating solution;
conveying the roll-to-roll substrate material through the electroless plating solution at a predetermined depth,
wherein a diameter of the first and the second depth setting rollers is selected to dispose the roll-to-roll substrate material at the predetermined depth.
12 . The method of claim 11 , further comprising;
disposing a cover over at least a portion of an exposed surface area of the electroless plating solution in a location between the first depth setting roller and the second depth setting roller.
13 . The method of claim 11 , further comprising:
disposing a plurality of wheels within the electroless plating bath, wherein the plurality of wheels assist conveyance of the roll-to-roll substrate material while submerged at the predetermined depth.
14 . The method of claim 11 , wherein the depth setting roller comprises:
a cylindrical sleeve having a radius greater than the predetermined depth;
a cylindrical cover disposed within a distal end of the cylindrical sleeve, wherein the cylindrical cover comprises a plug hole disposed at a center of the cylindrical cover;
a plug disposed within the plug hole, wherein the plug comprises a pin hole disposed at a center of the plug;
a spring disposed within the pin hole; and
an axial pin partially disposed within the pin hole.
15 . The method of claim 11 , wherein the depth setting roller comprises a material resistant to electroless plating.
16 . The method of claim 11 , wherein the first depth setting roller and the second depth setting roller are removable.
17 . The method of claim 11 , wherein the predetermined depth may be controlled by a diameter of the first depth setting roller and the second depth setting roller.
18 . The method of claim 11 , wherein the predetermined depth is in a range between approximately 2 inches and approximately 3 inches.
19 . The method of claim 11 , wherein the first depth setting roller and the second depth setting roller are not driven.
20 . The method of claim 11 , wherein the first depth setting roller and the second depth setting roller are driven with a motor.