IP Library Granted Patent US 9,543,481
Granted Patent B2
US 9,543,481 · App. 14/496,020 · Granted Jan 10, 2017

Semiconductor nanoparticle-based materials

Inventors: Nigel Pickett (Manchester, GB); Imad Naasani (Manchester, GB); James Harris (Manchester, GB)
Assignee: Nanoco Technologies Ltd.
H01L33/502C09K11/025C09K11/565C09K11/70C09K11/883H01L33/005H01L33/56H01L33/504H01L2224/48091H01L2933/0041
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Quick Facts
Patent No.
US 9,543,481
App. No.
14/496,020
Granted
Jan 10, 2017
Kind
B2
Abstract

The present invention relates to a primary particle comprised of a primary matrix material containing a population of semiconductor nanoparticles, wherein each primary particle further comprises an additive to enhance the physical, chemical and/or photo-stability of the semiconductor nanoparticles. A method of preparing such particles is described. Composite materials and light emitting devices incorporating such primary particles are also described.

Claims (21)

1. A method of making a quantum dot (QD)-containing bead-in-bead composition, the method comprising:

encapsulating a plurality of QDs within a first bead material to provide a plurality of primary beads, each primary bead containing a plurality of QDs encapsulated therein;

encapsulating a plurality of the primary beads within a second bead material to provide a plurality of secondary beads, each secondary bead containing a plurality of primary beads encapsulated therein;

incorporating a stability-enhancing additive into either the primary bead or into the secondary bead; and,

coating the primary beads with an inorganic protective surface.

2. The method of claim 1 , wherein the QDs comprise ions selected from group 13 and group 15 of the periodic table.

3. The method of claim 1 , wherein the first bead material comprises resin, polymer, glass, sol gel, epoxy, silicone, acrylate, or silica.

4. The method of claim 1 , wherein the first bead material is a (meth)acrylate polymer.

5. The method of claim 1 , wherein the first bead material is silica.

6. The method of claim 1 , wherein encapsulating a plurality of QDs within a first bead material comprises suspending the plurality of QDs in a solution of monomer and polymerizing the monomer to provide the first bead material.

7. The method of claim 1 , wherein encapsulating a plurality of QDs within a first bead material comprises suspending the plurality of QDs and a plurality of primary beads in a liquid and allowing the QDs to absorb into the primary beads.

8. The method of claim 1 , wherein the primary beads are about 20 nm to about 0.5 mm in diameter.

9. The method of claim 1 , wherein the inorganic protective surface comprises Al 2 O 3 .

10. The method of claim 1 , wherein the second bead material comprises polymer, resin, glass, sol gel, epoxy, silicone, or (meth)acrylate.

11. The method of claim 1 , wherein the second bead material is a silicone polymer.

12. The method of claim 1 , wherein the stability-enhancing additive is a free-radical scavenger or a reducing agent.

13. A bead-in-bead composition comprising:

a plurality of primary beads encapsulated within a secondary bead, wherein each primary bead comprises a first bead material and a plurality of quantum dots (QDs) encapsulated within the primary bead, the secondary bead comprises a secondary bead material, the primary beads or the secondary bead comprise a stability-enhancing additive, and the primary beads comprise an inorganic protective surface.

14. The bead-in-bead composition of claim 13 , wherein the QDs comprise ions selected from group 13 and group 15 of the periodic table.

15. The bead-in-bead composition of claim 13 , wherein the first bead material comprises resin, polymer, glass, sol gel, epoxy, silicone, acrylate, or silica.

16. The bead-in-bead composition of claim 13 , wherein the primary beads are about 20 nm to about 0.5 mm in diameter.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 062977 FRAME 0157. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST. Recorded Jul 13, 2023
From: NANOCO TECHNOLOGIES LTD
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 064273/0340 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2023
From: NANOCO TECHNOLOGIES LTD
To: SAMSUNG ELECTRONICS CO. LTD
Reel/Frame 062977/0157 →
Priority Claims (1)
GB 0916699.2 · Sep 23, 2009 · national
Continuity (3)
Continuation 12888881 · Sep 23, 2010
Provisional Application 61246287 · Sep 28, 2009
Related Publication 20150048311A1 · Feb 19, 2015