IP Library Granted Patent US 9,190,566
Granted Patent B2
US 9,190,566 · App. 14/496,599 · Granted Nov 17, 2015

Light emitting device

Inventors: Jae Hoon Choi (Seoul, KR); Young Jae Choi (Seoul, KR); Ho Jun Lee (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
H01L33/12H01L33/007H01L33/32
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Quick Facts
Patent No.
US 9,190,566
App. No.
14/496,599
Granted
Nov 17, 2015
Kind
B2
Abstract

Disclosed is a light emitting device package capable of improving luminous efficiency. The light emitting device includes a substrate; a first buffer layer on the substrate; a first insulating layer on the first buffer layer; a second buffer layer on the first insulating layer; a second insulating layer on the second buffer layer; a third buffer layer around the second buffer layer and the insulating layer; and a light emitting structure on the third buffer layer.

Claims (35)

1. A light emitting device comprising:

a substrate;

a first buffer layer on the substrate;

a first insulating layer on the first buffer layer;

a second buffer layer on the first insulating layer;

a second insulating layer on the second buffer layer;

a third buffer layer around the second buffer layer and the second insulating layer; and

a light emitting structure on the third buffer layer.

2. The light emitting device of claim 1 , wherein a side surface of the second buffer layer is disposed inwardly of side surfaces of the first and second insulating layers to expose a lower edge of the second insulating layer and an upper edge of the first insulating layer.

3. The light emitting device of claim 2 , wherein the side surfaces of the first and second insulating layers are disposed on a same vertical line.

4. The light emitting device of claim 3 , wherein the third buffer layer extends horizontally to cover a lower edge of the second insulating layer and an upper edge of the first insulating layer.

5. The light emitting device of claim 1 , wherein a thickness of the second buffer layer is thicker than thicknesses of the first and second insulating layers.

6. The light emitting device of claim 5 , wherein the thickness of the second buffer layer is in a range of 4,500 Å to 5,500 Å.

7. The light emitting device of claim 1 , wherein a lattice constant of the third buffer layer is less than a lattice constant of the second buffer layer.

8. The light emitting device of claim 1 , wherein the first to third buffer layers include a group III-V compound semiconductor or a group II-VI compound semiconductor.

9. The light emitting device of claim 8 , wherein the first buffer layer includes AIN or Al 2 O 3 .

10. The light emitting device of claim 8 , wherein the second buffer layer includes ZnO.

11. The light emitting device of claim 8 , wherein the third buffer layer includes GaN.

12. The light emitting device of claim 1 , wherein the first and second insulating layers include SiO 2 or SiNx.

13. The light emitting device of claim 1 , wherein the third buffer layer does not make contact with the substrate.

14. The light emitting device of claim 1 , wherein the light emitting structure includes a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer.

15. A light emitting device comprising:

a substrate;

a first buffer layer provided on the substrate in a form of a plurality of patterns;

a first insulating layer on the patterns of the first buffer layer;

a second buffer layer on a pattern of the first insulating layer;

a second insulating layer on a pattern of the second buffer layer;

a third buffer layer around the patterns of the second buffer layer and the second insulating layer; and

a light emitting structure on the third buffer layer,

wherein a distance between the patterns of the second buffer layer is longer than a distance between the patterns of the second insulating layer.

16. The light emitting device of claim 15 , wherein a side surface of the second buffer layer is disposed inwardly of a side surface of the second insulating layer.

17. The light emitting device of claim 15 , wherein the third buffer layer is aligned to cover a lower edge of the second insulating layer.

18. The light emitting device of claim 15 , wherein the third buffer layer is aligned to cover an upper edge of the first insulating layer.

19. The light emitting device of claim 18 , wherein a lower region of the third buffer layer is disposed horizontally with the first insulating layer.

20. The light emitting device of claim 15 , wherein a thickness of the second buffer layer is thicker than thicknesses of the first and second insulating layers.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2024
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 068839/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2014
From: CHOI, JAE HOON; CHOI, YOUNG JAE; LEE, HO JUN
To: LG INNOTEK CO., LTD.
Reel/Frame 033855/0569 →
Priority Claims (1)
KR 10-2013-0114275 · Sep 26, 2013 · national
Continuity (1)
Related Publication 20150083995A1 · Mar 26, 2015