Sensor device with integrated calibration system and calibration method
An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.
1. An integrated sensor device, comprising:
a first die including a sensor element configured to detect a quantity external to the sensor device and transduce said external quantity into an electrical sensing signal;
a second die mechanically coupled to the first die, the first and second dies stacked on one another along a first axis;
a resistive heater, having a first conduction terminal and a second conduction terminal;
a temperature sensor configured to sense a temperature of the sensor element;
a signal generator having a first conduction terminal and a second conduction terminal electrically coupled to the first and second conduction terminals of the resistive heater, respectively, and configured to provide an electric current between the first and second conduction terminals of the resistive heater to generate heat by the Joule effect to bring the sensor element to a threshold temperature; and
a calibration circuit configured to receive the sensed temperature of the sensor element from the temperature sensor, acquire said electrical sensing signal when the sensed temperature of the sensor element has reached said threshold temperature, and to obtain an offset value that biases the electrical sensing signal when the sensed temperature of the sensor element has reached said threshold temperature.
2. The integrated sensor device of claim 1 wherein the resistive heater is integrated in the first die.
3. The integrated sensor device of claim 1 wherein the resistive heater is integrated in the second die.
4. The integrated sensor device according to claim 1 wherein the resistive heater includes a plurality of heater sub-elements electrically coupled together by electrical-connection sub-regions.
5. The integrated sensor device according to claim 4 wherein the resistive heater has a serpentine-like shape in which said plurality of heater sub-elements extend to form mutually parallel conductive strips, and said electrical-connection sub-regions extend orthogonal to the heater sub-elements electrically coupling in series together two adjacent heater sub-elements.
6. The integrated sensor device according to claim 1 wherein the heater extends in a region of the first die that is substantially aligned, along the first axis, to the sensor element.
7. The integrated sensor device according to claim 1 wherein the heater extends in a region of the first die without electrical components.
8. The integrated sensor device according to claim 1 wherein the heater includes at least one from among: a strip of conductive material, a region implanted with dopant species, and a transistor.
9. The integrated sensor device according to claim 1 wherein said signal generator is integrated in the first die.
10. The integrated sensor device according to claim 1 wherein the signal generator is configured to supply said electric current in the form of current pulses.
11. The integrated sensor device according to claim 1 wherein the second die houses an integrated circuit operatively coupled to the sensor element and configured to acquire said electrical sensing signal.
12. The integrated sensor device according to claim 1 , further comprising a third die that forms a base support of a package adapted to house, in an internal cavity, said first and second dies.
13. The integrated sensor device according to claim 1 , further comprising a third die housing an integrated circuit operatively coupled to the sensor element of the first die and configured to acquire said electrical sensing signal, and wherein said second die is a base support of a package, said package having an internal cavity to house said first and third die.
14. A method, comprising:
calibrating an integrated sensor device that includes a first die coupled to a second die, the first die includes a sensor element configured to detect a quantity external to the sensor device and transduce said external quantity into an electrical sensing signal, the integrated sensor device includes a resistive heater, the calibrating including:
generating a flow of electric current between first and second conduction terminals of the heater with a signal generator for generating heat by the Joule effect;
measuring a temperature value by a temperature sensor embedded in the integrated sensor device;
receiving, by a calibration circuit, the measured temperature value from the temperature sensor;
acquiring, by the calibration circuit, the electrical sensing signal when the measured temperature value has reached a threshold temperature value; and
calibrating the sensor element based on the acquired electrical sensing signal.
15. The method according to claim 14 wherein calibrating the sensor element includes obtaining an offset value that afflicts the electrical sensing signal generated by the sensor element when the temperature value has reached the threshold temperature value.
16. The method according to claim 14 wherein generating a flow of electric current includes generating one or more pulses of electric current having a temporal duration between approximately 50 ms and 300 ms and an amplitude between approximately 50 mA and 300 mA.
17. A device, comprising:
a resistive heater element;
a first die that includes:
a sensor element; and
a temperature sensor configured to sense a temperature of the sensor element; and
a second die stacked on the first die, the second die includes:
a signal generator coupled to the resistive heater element, the signal generator being configured to heat the resistive heater element to a selected temperature for calibration of the device; and
a calibration circuit coupled to the sensor element, the calibration circuit being configured to receive the sensed temperature of the sensor element from the temperature sensor, acquire a sensing signal from the sensor element when the sensed temperature has reached a threshold temperature, and calibrate the sensor element based on the acquired sensing signal.
18. The device of claim 17 wherein the resistive heater is in the first die and is positioned between the sensor element and the signal generator of the second die.
19. The device of claim 17 wherein the heater element is in the first die and the sensor element is positioned between the heater element and the signal generator of the second die.
20. The device of claim 17 wherein the sensor element includes a ferromagnetic layer and a layer that includes copper portions.
21. The device of claim 17 , further comprising a support substrate, the resistive heater element being positioned in the support substrate, the first and second die being positioned on the support substrate.