Heat dissipation apparatus
View Patent ↗A heat dissipation apparatus includes an insulating plate, a conductive plate located on the insulating plate and a power source with an anode connected with the insulating plate and a cathode connected with the conductive plate. A conductive element is received in the insulating plate and is connected to the anode of the power source. When the heat dissipation apparatus is activated, the conductive element ionizes air closing to the insulating plate to produce positive ions. The conductive plate attracts the positive ions to move fast towards the conductive plate, which cause the air to flow in a direction in which the positive ions move.
1. A heat dissipation apparatus for dissipating heat by movement of air, comprising:
a perforated non-conductive insulating plate;
a perforated conductive plate; and
a conductive element,
wherein, the conductive element is positioned upon the non-conductive insulating plate;
wherein, the heat dissipation apparatus is electrically connectable to a power source having an anode and a cathode, with the anode being electrically connected to the conductive element and the cathode being electrically connected to the conductive plate;
wherein, the non-conductive insulating plate is positioned substantially parallel to the conductive plate; and
wherein, when the power source is activated, the conductive element generates an electric field producing positive ions in air and the conductive plate generates negative ions causing air movement towards the conductive plate.
2. The heat dissipation apparatus of claim 1 , wherein the conductive element is a wire with a diameter ranging from 0.025 mm to 0.05 mm.
3. The heat dissipation apparatus of claim 2 , wherein the insulating plate defines a plurality of first through holes, the conductive plate comprises a plurality of second through holes corresponding to the first through holes.
4. The heat dissipation apparatus of claim 3 , wherein the wire is arranged between the first through holes in series.
5. An electronic device, comprising:
an enclosure;
a number of electronic components received in the enclosure; and
a heat dissipation apparatus for dissipating heat by movement of air, comprising:
a perforated non-conductive insulating plate;
a perforated conductive plate; and
a conductive element,
wherein, the conductive element is positioned upon the non-conductive insulating plate;
wherein, the heat dissipation apparatus is electrically connectable to a power source having an anode and a cathode, with the anode being electrically connected to the conductive element and the cathode being electrically connected to the conductive plate;
Wherein, the non-conductive insulating plate is positioned substantially parallel to the conductive plate; and
wherein, when the power source is activated, the conductive element generates an electric field producing positive ions in air and the conductive plate generates negative ions causing air movement towards the conductive plate.
6. The electronic device of claim 5 , wherein the conductive element is a wire with a diameter ranging from 0.025 mm to 0.05 mm.
7. The electronic device of claim 6 , wherein the insulating plate defines a plurality of first through holes, the conductive plate comprises a plurality of second through holes corresponding to the first through holes.
8. The electronic device of claim 7 , wherein the wire is arranged between the first through holes in series.
9. The heat dissipation apparatus of claim 4 , wherein the wire extends along a part of outline of the plurality of the first through holes.
10. The electronic device of claim 8 , wherein the wire extends along a part of outline of the plurality of the first through holes.