IP Library Granted Patent US 9,224,523
Granted Patent B2
US 9,224,523 · App. 14/500,414 · Granted Dec 29, 2015

Inverter surge-resistant insulated wire

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Quick Facts
Patent No.
US 9,224,523
App. No.
14/500,414
Granted
Dec 29, 2015
Kind
B2
Abstract

An inverter surge-resistant insulated wire, having at least one baked enamel layer around the outer periphery of a conductor, and an extrusion-coated resin layer at the outside of the baked enamel layer, wherein a total thickness of the baked enamel layer and the extrusion-coated resin layer is 50 μm or more, a thickness of the baked enamel layer is 60 μm or less, and a thickness of the extrusion-coated resin layer is 200 μm or less, wherein the minimum of tensile elastic modulus of the extrusion-coated resin layer at a range of 25 to 250° C. is 100 MPa or more, wherein a dielectric constant of an insulation layer having a combination of the baked enamel layer and the extrusion-coated resin layer is 3.5 or less at 25° C. and 5.0 or less at 250° C., and wherein a relation between dielectric constant (∈1′) of the baked enamel layer at 250° C. and dielectric constant (∈2′) of the extrusion-coated resin layer at 250° C. satisfies (∈2′/∈1′)>1.

Claims (9)

1. An inverter surge-resistant insulated wire, having at least one baked enamel layer around the outer periphery of a conductor, and an extrusion-coated resin layer at the outside of the baked enamel layer,

wherein the extrusion-coated resin layer is a single layer, and a resin of the resin layer is a resin selected from polyether ether ketone, a thermoplastic polyimide, a polyamide having an aromatic ring, a polyester having an aromatic ring, and polyketone,

wherein a total thickness of the baked enamel layer and the extrusion-coated resin layer is 50 μm or more, a thickness of the baked enamel layer is 50 μm or less, and a thickness of the extrusion-coated resin layer is 200 μm or less,

wherein the minimum of tensile elastic modulus of the extrusion-coated resin layer at a range of 25 to 250° C. is 100 MPa or more and 400 MPa or less,

wherein a dielectric constant of an insulation layer having a combination of the baked enamel layer and the extrusion-coated resin layer is 3.0 or more and 3.5 or less at 25° C. and 4.0 or more and 5.0 or less at 250° C., and

wherein a relation between dielectric constant (∈1′) of the baked enamel layer at 250° C. and dielectric constant (∈2′) of the extrusion-coated resin layer at 250° C. satisfies 2.0≧(∈2′/∈1′)>1.

2. The inverter surge-resistant insulated wire according to claim 1 , wherein the extrusion-coated resin layer is a layer formed by polyether ether ketone.

3. The inverter surge-resistant insulated wire according to claim 1 , wherein the conductor has a rectangular cross-section.

4. The inverter surge-resistant insulated wire according to claim 1 , wherein the thickness of the backed enamel layer is 40 μm or less.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2025
From: FURUKAWA MAGNET WIRE CO., LTD.
To: ESSEX SOLUTIONS INC.
Reel/Frame 072420/0913 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2021
From: FURUKAWA MAGNET WIRE CO., LTD.
To: ESSEX FURUKAWA MAGNET WIRE LLC.
Reel/Frame 056150/0284 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2020
From: FURUKAWA ELECTRIC CO., LTD.
To: FURUKAWA ELECTRIC MAGNET WIRE AMERICA, INC.
Reel/Frame 054325/0650 →
SECURITY INTEREST Recorded Oct 16, 2020
From: ESSEX FURUKAWA MAGNET WIRE LLC
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054073/0917 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2020
From: FURUKAWA ELECTRIC MAGNET WIRE AMERICA, INC.
To: ESSEX FURUKAWA MAGNET WIRE LLC
Reel/Frame 054050/0242 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2020
From: FURUKAWA ELECTRIC CO., LTD.
To: FURUKAWA ELECTRIC MAGNET WIRE AMERICA, INC.
Reel/Frame 054049/0608 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2014
From: MUTO, DAISUKE; FUKUDA, HIDEO; TOMIZAWA, KEIICHI; NAKA, SATOSHI
To: FURUKAWA ELECTRIC CO., LTD.; FURUKAWA MAGNET WIRE CO., LTD.
Reel/Frame 033847/0944 →