Intrusion resistant thermal laminating film
View Patent ↗A thermal laminating film is provided that has superior intrusion resistance that is well suited to addressing security and anti-counterfeiting needs. The film includes a polymer substrate and an adhesive system with a polymer component having a Vicat softening point temperature that is close to a glass transition temperature of the polymeric substrate, which typically is not greater than about 95° C.
1. An intrusion resistant thermal laminating film comprising:
(a) a self-supporting polymeric substrate having a glass transition temperature of not greater than about 95° C., and the polymeric substrate is selected from the group consisting of a polycyclohexylenedimethylene terephthalate (PCTA), glycol-modified polycyclohexylenedimethylene terephthalate (PCTg), and combinations thereof;
(b) a thermal adhesive system adhered to said polymeric substrate to form an intrusion resistant thermal laminating film, said adhesive system comprising a blend of one or more alkyl acrylate or alkyl acrylic acid copolymers selected from the group consisting of ethylene acrylic acid (EAA), ethylene methacrylate (EMA) and combinations thereof; and one or more low density polyethylenes, said adhesive system having a Vicat softening point that is below the polymeric substrate glass transition temperature and between about 80° C. and 95° C., said adhesive system having a melt flow index (MFI) of about 15 grams or less per ten minutes; and
(c) the intrusion resistant thermal laminating film maintains adhesion between the adhesive system and the polymeric substrate and achieves cohesive failure of the adhesive system upon subjecting the intrusion resistant thermal laminating film to an elevated temperature below the polymeric substrate glass transition temperature.
2. The film of claim 1 , wherein said polymeric substrate is transparent and amorphous.
3. The film of claim 1 , wherein the Vicat softening point is within 15° C. of said glass transition temperature.
4. The film of claim 1 , wherein the Vicat softening point is within 10° C. of said glass transition temperature.
5. The film of claim 1 , wherein the Vicat softening point is within 5° C. of said glass transition temperature.
6. The film of claim 1 , wherein the Vicat softening point is within 3° C. of said glass transition temperature.
7. The film of claim 1 , wherein said adhesive system has a melt flow index (MFI) of about 12 grams or less per ten minutes.
8. The film of claim 1 , wherein said adhesive system has a melt flow index (MFI) of about 10 grams or less per ten minutes.
9. The film of claim 1 , wherein said adhesive system has a melt flow index (MFI) of about 5 grams or less per ten minutes.
10. The film of claim 1 , wherein said cohesive failure of the adhesive system is about 5 or greater.
11. The film of claim 1 , wherein said cohesive failure of the adhesive system is about 10 or greater.
12. The film of claim 1 , wherein said cohesive failure of the adhesive system is about 12 or greater.
13. The film of claim 1 , wherein said low density polyethylene is selected from the group consisting of maleic anhydride modified linear low density polyethylene (MA-LLDPE), low density polyethylene (LDPE) and combinations thereof.
14. An intrusion resistant thermal laminating film comprising:
(a) a self-supporting polymeric substrate having a glass transition temperature of not greater than about 95° C., the polymeric substrate being selected from the group consisting of a polycyclohexylenedimethylene terephthalate (PCTA), glycol-modified polycyclohexylenedimethylene terephthalate (PCTg), and combinations thereof;
(b) a thermal adhesive system adhered to said polymeric substrate to form an intrusion resistant thermal laminating film, said adhesive system comprising a blend of one or more alkyl acrylate or alkyl acrylic acid copolymers selected from the group consisting of ethylene acrylic acid (EAA), ethylene methacrylate (EMA) and combinations thereof; and one or more low density polyethylenes, said adhesive system having a Vicat softening point that is below the polymeric substrate glass transition temperature and between about 80° C. and 95° C., said adhesive system having a melt flow index (MFI) of about 15 grams or less per ten minutes;
(c) the intrusion resistant thermal laminating film maintains adhesion between the adhesive system and the polymeric substrate and achieves cohesive failure of the adhesive system upon subjecting the intrusion resistant thermal laminating film to an elevated temperature below the polymeric substrate glass transition temperature; and
wherein said thermal adhesive system comprises between about 75 weight percent and about 100 weight percent ethylene acrylic acid (EAA) and up to about 25 weight percent of ethylene methacrylate (EMA) copolymer, based on the total weight of the alkyl acrylate or alkyl acrylic acid copolymer.
15. The intrusion resistant thermal laminating film of claim 14 , wherein the thermal adhesive system comprises about 90 weight percent of said ethylene acrylic acid (EAA) and about 10 weight percent of said ethylene methacrylate (EMA), based on the total weight of the alkyl acrylate or alkyl acrylic acid copolymer.