IP Library Granted Patent US 9,042,048
Granted Patent B1
US 9,042,048 · App. 14/503,042 · Granted May 26, 2015

Laser-ignited reactive HAMR bonding

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Quick Facts
Patent No.
US 9,042,048
App. No.
14/503,042
Granted
May 26, 2015
Kind
B1
Abstract

The present disclosure generally relates to a HAMR head and a method for fabrication thereof. The HAMR head has a write head with a waveguide extending therethrough. A laser diode is coupled to a submount that is bonded to the write head using an adhesion layer, a solder structure, and a self-propagating multilayer alloying stack.

Claims (55)

1. A magnetic recording head, comprising:

a slider body;

a write head coupled to the slider body, the write head having an air bearing surface and a second surface opposite the air bearing surface, the write head including:

a near field transducer disposed at the air bearing surface; and

a waveguide extending from the second surface to the near field transducer;

a submount coupled to the slider body;

a laser diode coupled to the submount and aligned with the waveguide such that light emitted from the laser diode is directed to the waveguide;

a solder structure coupled between the submount and the slider body;

an adhesion layer coupled between the slider body and the solder structure; and

a self-propagating, multilayer alloying stack disposed between one of the following:

the adhesion layer and the solder structure; or

the solder structure and the submount.

2. The magnetic recording head of claim 1 , wherein the self-propagating, multilayer alloying stack comprises alternating layers of nickel and aluminum.

3. The magnetic recording head of claim 2 , wherein the solder structure comprises alternating layers of gold and tin.

4. The magnetic recording head of claim 3 , wherein the self-propagating, multilayer alloying stack has a thickness of between about ⅛ to about ⅙ a thickness of the solder structure.

5. The magnetic recording head of claim 4 , wherein the adhesion layer comprises gold.

6. The magnetic recording head of claim 5 , wherein a first layer of the self-propagating, multilayer alloying stack that is in contact with the adhesion layer comprises nickel.

7. The magnetic recording head of claim 6 , wherein a topmost layer of the self-propagating, multilayer alloying stack that is in contact with the solder structure comprises aluminum.

8. The magnetic recording head of claim 1 , wherein the self-propagating, multilayer alloying stack comprises an even number of layers with a total number of layers being greater than 2 and wherein each layer has a thickness of between about 40 nm and about 55 nm.

9. A hard disk drive, comprising:

a disk drive body having an enclosure;

a magnetic recording medium disposed within the enclosure;

a magnetic recording head disposed within the enclosure, the head comprising:

a slider body;

a write head coupled to the slider body, the write head having an air bearing surface and a second surface opposite the air bearing surface, the write head including:

a near field transducer disposed at the air bearing surface; and

a waveguide extending from the second surface to the near field transducer;

a submount coupled to the slider body;

a laser diode coupled to the submount and aligned with the waveguide such that light emitted from the laser diode is directed to the waveguide;

a solder structure coupled between the submount and the slider body;

an adhesion layer coupled between the slider body and the solder structure; and

a self-propagating, multilayer alloying stack disposed between one of the following:

the adhesion layer and the solder structure; or

the solder structure and the submount.

10. The hard disk drive of claim 9 , wherein the self-propagating, multilayer alloying stack comprises alternating layers of nickel and aluminum.

11. The hard disk drive of claim 10 , wherein the solder structure comprises alternating layer of gold and tin.

12. The hard disk drive of claim 11 , wherein the self-propagating, multilayer alloying stack has a thickness of between about ⅛ to about ⅙ a thickness of the solder structure.

13. The hard disk drive of claim 12 , wherein the adhesion layer comprises gold.

14. The hard disk drive of claim 13 , wherein a first layer of the self-propagating, multilayer alloying stack that is in contact with the adhesion layer comprises nickel.

15. The hard disk drive of claim 14 , wherein a topmost layer of the self-propagating, multilayer alloying stack that is in contact with the solder structure comprises aluminum.

16. The hard disk drive of claim 9 , wherein the self-propagating, multilayer alloying stack comprises an even number of layers with a total number of layers being greater than 2 and wherein each layer has a thickness of between about 40 nm and about 55 nm.

17. A method of making a magnetic recording head, comprising:

depositing an adhesion layer over a slider having a write head coupled thereto, the write head having a waveguide extending therethrough;

depositing a self-propagating, multilayer alloying stack over the slider;

depositing a solder structure over the adhesion layer;

disposing a submount on the solder structure, the submount having a laser diode coupled thereto;

directing the laser towards the waveguide; and

igniting the self-propagating, multilayer alloying stack to bond the submount to the slider, wherein the self-propagating, multilayer alloying stack is disposed in one of the following locations:

between the adhesion layer and the solder structure; or

between the solder structure and the submount.

18. The method of claim 17 , wherein directing the laser at the waveguide comprises:

directing the laser at the waveguide for a first period of time at a first power level to align the laser relative to the waveguide; and

directing the laser at the waveguide for a second period of time that is less than the first period of time and at a second power level that is greater than the first power level.

19. The method of claim 18 , wherein the self-propagating, multilayer alloying stack comprises alternating layer of nickel and aluminum.

20. The method of claim 19 , wherein the self-propagating, multilayer alloying stack has a thickness of between about ⅛ to about ⅙ a thickness of the solder structure.

Assignments (10)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038710 FRAME 0845 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL (FREMONT), LLC; WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0445 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2019
From: WESTERN DIGITAL (FREMONT), LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 050450/0582 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 045501/0158 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0755 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0675 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038710/0845 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2015
From: BROTHERS, ALAN H.
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 036301/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2015
From: BROTHERS, ALAN H.
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 034998/0295 →