Cream solder composition
View Patent ↗A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.
1. A cream solder composition comprising a flux that includes an epoxy resin, an organic carboxylic acid and a plastic having a linear structure as a heat-resistant shape-retaining agent; and a particulate lead free solder, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.
2. The cream solder composition according to claim 1 , wherein the plastic having a linear structure is one or more types of plastic selected from among a polyamide derived from a cyclic amide monomer and polypropylene.
3. The cream solder composition according to claim 1 , wherein the plastic having a linear structure is blended at a quantity of 0.5 to 30 mass % relative to the total mass of the flux.
4. The cream solder composition according to claim 1 , further containing an alcohol at a quantity of 30 mass % or lower relative to the total mass of the flux.
5. The cream solder composition according to claim 1 , wherein the epoxy resin is selected from among the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, novolac type epoxy resins, alicyclic epoxy resins and mixtures thereof.
6. The cream solder composition according to claim 1 , wherein the bisphenol A type epoxy resin is a bisphenol A type epoxy resin having an epoxy equivalent weight of 160 to 250 g/eq.
7. The cream solder composition according to claim 1 , further containing an activator that removes oxides, the activator being selected from among the group consisting of amines, halogenated amines, halogenated organic acid salts, halogen compounds, organic acids, acid anhydrides and mixtures thereof.
8. A cream solder composition according to claim 1 wherein the particulate lead-free solder has a melting point of 190 to 240° C.
9. The cream solder composition according to claim 8 , wherein the particulate lead-free solder has a particle diameter of 20 to 40 μm.
10. The cream solder composition according to claim 1 , wherein the particulate lead-free solder is a tin-containing lead-free solder having a melting point of 190 to 240° C.
11. The cream solder composition according to claim 1 , additionally comprising an alcohol in an amount of 10 to 20 mass % relative to total mass of the flux.
12. The cream solder composition according to claim 1 , wherein the particulate lead-free solder has a particle diameter of 20 to 40 μm.