IP Library Granted Patent US 9,964,257
Granted Patent B2
US 9,964,257 · App. 14/510,173 · Granted May 8, 2018

Illumination device for preventing a removal of a module substrate and suppressing generation of a crack in the module substrate

Inventors: Tetsushi Tamura (Nigata, JP); Yukiya Kanazawa (Osaka, JP); Takuya Matsumoto (Osaka, JP); Yoshitaka Kurimoto (Osaka, JP)
Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
F21K9/1355F21K9/23F21K9/238F21V19/005F21V19/0055F21V23/006F21V23/009F21V29/002F21V29/70F21V17/005F21V23/002F21Y2115/10
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Quick Facts
Patent No.
US 9,964,257
App. No.
14/510,173
Granted
May 8, 2018
Kind
B2
Abstract

An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base having a mounting surface on which the light emitting module is mounted, and a cover portion configured to cover an edge portion of the module substrate without pressing the edge portion. The module substrate includes a surface which is bonded to the mounting surface of the base through an adhesive layer. The base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate. The cover portion is provided on the protrusion.

Claims (25)

1. An illumination device, comprising:

a light emitting module including a module substrate and a semiconductor light emitting element mounted to the module substrate;

a base including a mounting surface on which the light emitting module is mounted; and

a cover portion configured to cover an edge portion of the module substrate with a clearance between the cover portion and the edge portion and without pressing the edge portion,

wherein the module substrate includes a surface which is directly bonded to the mounting surface of the base through an adhesive layer, and

wherein the base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate and the cover portion is provided on the protrusion.

2. The illumination device of claim 1 , wherein a through-hole is formed in a region of the module substrate excluding a region where the semiconductor light emitting element exists, the protrusion passing through the through-hole; and the edge portion of the module substrate includes an edge of the through-hole.

3. The illumination device of claim 1 , wherein the cover portion is larger in diameter than the protrusion and is fixed to a top portion of the protrusion.

4. The illumination device of claim 2 , wherein the cover portion is larger in diameter than the protrusion and is fixed to a top portion of the protrusion.

5. The illumination device of claim 1 , wherein the cover portion is fixed to the protrusion by a shaft having a head portion and mounted to the base.

6. The illumination device of claim 2 , wherein the cover portion is fixed to the protrusion by a shaft having a head portion and mounted to the base.

7. The illumination device of claim 1 , wherein the base further includes a rib provided on the mounting surface thereof, the rib serving to position the module substrate on the mounting surface.

8. The illumination device of claim 2 , wherein the base further includes a rib provided on the mounting surface thereof, the rib serving to position the module substrate on the mounting surface.

9. The illumination device of claim 1 , wherein the module substrate is made of a ceramic material.

10. The illumination device of claim 2 , wherein the module substrate is made of a ceramic material.

11. The illumination device of claim 1 , wherein the adhesive layer is made of a thermally conductive material.

12. The illumination device of claim 2 , wherein the adhesive layer is made of a thermally conductive material.

13. The illumination device of claim 1 , wherein the adhesive layer covers only a portion of the surface of the module substrate.

14. The illumination device of claim 2 , wherein the adhesive layer covers only a portion of the surface of the module substrate.

15. The illumination device of claim 1 , further comprising:

a circuit unit configured to drive the light emitting module and a circuit case accommodating and holding the circuit unit in an internal space of the circuit case, the circuit unit and the circuit case being provided at the side of a rear surface of the base opposite to the mounting surface,

wherein the circuit case includes a tubular portion having an opening disposed so as to face toward the rear surface and an insulation portion interposed between the rear surface of the base and the circuit unit so as to cover the opening of the tubular portion, and

the insulation portion includes a window through which the internal space of the circuit case leads to the rear surface of the base.

16. The illumination device of claim 1 , wherein the clearance is directly between the cover portion and the edge portion and comprises an empty space.

17. The illumination device of claim 16 , wherein the cover portion is above the edge portion in a vertical direction perpendicular to the surface of the module substrate, the clearance being directly between the cover portion and the edge portion in the vertical direction.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034537/0136 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2014
From: TAMURA, TETSUSHI; KANAZAWA, YUKIYA; MATSUMOTO, TAKUYA; KURIMOTO, YOSHITAKA
To: PANASONIC CORPORATION
Reel/Frame 034192/0245 →
Priority Claims (1)
JP 2013-212010 · Oct 9, 2013 · national
Continuity (1)
Related Publication 20150098230A1 · Apr 9, 2015