APPARATUS AND METHOD FOR PROTECTING A COMPONENT
According to various, but not necessarily all, examples of the disclosure there may be provided an apparatus and method, the apparatus may comprise: an encapsulated portion configured to receive at least one component wherein the encapsulated portion comprises at least one barrier wall; and a source of gas provided within the encapsulated portion and configured to cause a net flow of gas through the barrier walls from inside the encapsulated portion to outside the encapsulated portion.
1 . An apparatus comprising:
an encapsulated portion configured to receive at least one component wherein the encapsulated portion comprises at least one barrier wall; and
a source of gas provided within the encapsulated portion and configured to cause a net flow of gas through the barrier walls from inside the encapsulated portion to outside the encapsulated portion.
2 . An apparatus as claimed in claim 1 wherein the at least one component comprises an electronic component.
3 . An apparatus as claimed in claim 1 wherein the source of gas comprises a material provided inside the encapsulated portion which is configured to emit gas.
4 . An apparatus as claimed in claim 3 wherein the material configured to emit gas comprises an adhesive wherein gas is dissolved in the adhesive.
5 . An apparatus as claimed in claim 3 wherein the material configured to emit gas is provided overlaying a component.
6 . An apparatus as claimed in claim 3 wherein the material configured to emit gas is provided on a substrate adjacent to a component.
7 . An apparatus as claimed in claim 1 wherein the source of gas is provided by configuring the pressure inside the encapsulated portion to be greater than the pressure outside the encapsulated portion.
8 . An apparatus as claimed in claim 7 wherein the pressure difference is created by forming the encapsulated portion at temperatures below the ambient temperature of the apparatus.
9 . An apparatus as claimed in claim 7 wherein the pressure difference is created by forming the encapsulated portion at pressures above the ambient pressure of the apparatus.
10 . An apparatus as claimed in claim 1 wherein the gas provided by the source of gas comprises an inert gas.
11 . An apparatus as claimed in claim 1 wherein the gas provided by the source of gas comprises a hygroscopic gas.
12 . An apparatus as claimed in claim 1 wherein the at least one component comprises a display.
13 . An apparatus as claimed in claim 1 wherein the at least one component comprises a photovoltaic cell.
14 . An apparatus as claimed in claim 1 wherein the at least one component comprises a sensor.
15 . An apparatus as claimed in claim 1 wherein the at least one component comprises a super capacitor.
16 . An apparatus as claimed in claim 1 wherein the at least one component comprises a battery.
17 . An apparatus as claimed in claim 1 wherein the at least one component comprises a moisture sensitive device.
18 . An apparatus as claimed in claim 1 wherein the apparatus is flexible.
19 . A method comprising:
providing at least one component within an encapsulated portion wherein the encapsulated portion comprises at least one barrier wall; and
providing a source of gas provided within the encapsulated portion wherein the source of gas is configured to cause a net flow of gas through the barrier walls from inside the encapsulated portion to outside the encapsulated portion.
20 . A method as claimed in claim 19 wherein the at least one component comprises an electronic component.
21 . A method as claimed in claim 19 wherein the source of gas comprises a material provided inside the encapsulated portion which is configured to emit gas.
22 . A method as claimed in claim 21 wherein the material configured to emit gas comprises an adhesive wherein gas is dissolved in the adhesive.
23 . A method as claimed in claim 19 wherein the material configured to emit gas is provided overlaying a component.
24 . A method as claimed in claim 19 wherein the material configured to emit gas is provided on a substrate adjacent to a component.
25 . A method as claimed in claim 19 wherein the source of gas is provided by configuring the pressure inside the encapsulated portion to be greater than the pressure outside the encapsulated portion.
26 . A method as claimed in claim 25 wherein the pressure difference is created by forming the encapsulated portion at temperatures below the ambient temperature of the apparatus.
27 . A method as claimed in claim 25 wherein the pressure difference is created by forming the encapsulated portion at pressures above the ambient pressure of the apparatus.
28 . A method as claimed in claim 19 wherein the gas provided by the source of gas comprises an inert gas.
29 . A method as claimed in claim 19 wherein the gas provided by the source of gas comprises a hygroscopic gas.
30 . A method as claimed in claim 19 wherein the at least one component comprises a display.
31 . A method as claimed in claim 19 wherein the at least one component comprises a photovoltaic cell.
32 . A method as claimed in claim 19 wherein the at least one component comprises a sensor.
33 . A method as claimed in claim 19 wherein the at least one component comprises a super capacitor.
34 . A method as claimed in claim 19 wherein the at least one component comprises a battery
35 . A method as claimed in claim 19 wherein the at least one component comprises a moisture sensitive device.
36 . A method as claimed in claim 19 wherein the apparatus is flexible.