Microelectromechanical device with protection for bonding

1. A microelectromechanical device comprising:

a substrate;

a semiconductor die adhered to the substrate and incorporating a microstructure, the die including a supporting frame defining a cavity;

a film adhesive layer between the supporting frame and the substrate; and

a layer of porous material between the supporting frame and the film adhesive layer, the layer of porous material having a plurality of pores, the film adhesive layer adhering the die to the substrate through the plurality of pores of the layer of porous material, the cavity overlapping a portion of the film adhesive layer and a portion of the layer of porous material.

2. The device according to claim 1 , wherein each of the plurality of pores has a diameter between 35 μm and 5 μm.

3. The device according to claim 1 , wherein the layer of porous material is made of a polymeric material.

4. The device according to claim 1 , wherein the microstructure overlies the cavity and is a distance from the substrate.

5. The device according to claim 4 , wherein the film adhesive layer adheres to the supporting frame.

6. The device according to claim 4 , wherein the microstructure is elastically coupled to the supporting frame through elastic connection elements and suspended above the cavity.

7. The device according to claim 6 , wherein the connection elements are configured to allow relative movements of the microstructure with respect to the supporting frame.

8. The device according to claim 4 , wherein the microstructure includes a movable supporting element elastically coupled to the supporting frame, and a semiconductor membrane supported by the movable supporting element.

9. The microelectromechanical device according to claim 1 , wherein the substrate comprises an integrated control circuit electrically coupled to the microstructure.

10. The microelectromechanical device of claim 1 , wherein the supporting frame includes an elevated portion and sidewalls.

11. The microelectromechanical device of claim 10 , wherein the film adhesive layer and the layer of porous material extend from a first sidewall of the sidewalls, across the cavity, and to a second sidewall, opposite to the first sidewall, of the sidewalls.

12. The microelectromechanical device of claim 1 , further comprising an integrated circuit in the substrate, the integrated circuit being spaced from the die by the film adhesive layer and the layer of porous material.

13. A microelectromechanical microphone comprising:

a microelectromechanical device including:

a first semiconductor die;

a second semiconductor die having a first surface and a second surface opposite to the first surface, the first surface including a movable membrane, the second surface including a cavity, the second surface facing the first semiconductor die;

a film adhesive layer between the second semiconductor die and the first semiconductor die, the film adhesive layer in physical contact with the first semiconductor die; and

a protective layer between the second semiconductor die and the film adhesive layer, the protective layer including a plurality of apertures, the film adhesive layer extending through the apertures of the protective layer and physically contacting the second surface of the second semiconductor die to adhere the second semiconductor die to the first semiconductor die, the cavity directly overlying a portion of the film adhesive layer and a portion of the protective layer.

14. The microelectromechanical microphone according to claim 13 , wherein the protective layer includes at least one of a resilient material, a layer of woven material, and sheets of porous polymeric material.

15. An electronic system comprising:

a control unit; and

a microelectromechanical device coupled to the control unit, the microelectromechanical device including:

a first semiconductor die having a surface;

a second semiconductor die including a support frame and a microstructure, the support frame forming a cavity, the microstructure overlying the cavity;

a film adhesive layer adhering to the surface of the first semiconductor die; and

a protective layer having a plurality of pores located between the support frame and the film adhesive layer,

the film adhesive layer extending from a first side of the protective layer, through the plurality of pores of the protective layer, and to a second side, opposite to the first side, of the protective layer,

the film adhesive adhering the support frame of the second semiconductor die to the first semiconductor die,

the film adhesive layer and the protective layer extending across the cavity such that the microstructure overlies the film adhesive layer and the protective layer.

16. The electronic system according to claim 15 , wherein the protective layer includes sheets of porous polymeric material.