IP Library Granted Patent US 9,839,161
Granted Patent B2
US 9,839,161 · App. 14/513,062 · Granted Dec 5, 2017

Thermal ducting for improved cooling in rack domains

Inventors: Steven Embleton (Austin, TX); Rene Jason Salas (Round Rock, TX)
Assignee: Dell Products L.P.
H05K7/20736H05K7/20727
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Quick Facts
Patent No.
US 9,839,161
App. No.
14/513,062
Granted
Dec 5, 2017
Kind
B2
Abstract

A thermal ducting rail receives a rack device in a rack chassis. The thermal ducting rail includes air flow guiding elements that enable cooling air from a front face of the rack chassis to be directed to an external side of the thermal ducting rail and from the external side to a rear face of the rack chassis. The thermal ducting rail enables rack devices equipped with side-to-side cooling to receive cooling air in a rack chassis with front-to-back cooling, without extending beyond a unit height occupied by the rack device.

Claims (37)

1. A thermal ducting rail for rack chassis, the thermal ducting rail comprising:

a front perforation to receive cooling air from the environment from a front portion of a rack chassis, the front perforation located on the thermal ducting rail at a front portion of the thermal ducting rail;

a front duct to guide the cooling air received from the environment by the front perforation to an external side of the thermal ducting rail and along the external side of the thermal ducting rail toward a rear portion of the rack chassis, wherein the front duct is located at the external side of the thermal ducting rail and does not extend beyond the front portion of the thermal ducting rail; and

a rear perforation to:

receive the cooling air guided by said front duct along the external side of the thermal ducting rail at an internal side of the thermal ducting rail behind a rear face of a rack device that is separate from the thermal ducting rail and is installed in the thermal ducting rail; and

enable the cooling air to exit at the rear portion of the rack chassis behind the rear face of the rack device, the rear perforation located at a rear portion of the thermal ducting rail;

wherein the thermal ducting rail receives the rack device for installing, at one side of the rack device, the rack device into the thermal ducting rail while the thermal ducting rail is installed in the rack chassis.

2. The thermal ducting rail of claim 1 , further comprising:

a rear mounting element for a rack device, the rear mounting element enabling rear detention of the rack device when the rack device is installed in the thermal ducting rail, and wherein the rear mounting element is adjustable along the thermal ducting rail.

3. The thermal ducting rail of claim 2 , further comprising:

a spring included in the rear mounting element, the spring exerting forward force on the rack device when the rack device is installed in the thermal ducting rail.

4. The thermal ducting rail of claim 2 , further comprising:

a front mounting element for the rack device, the front mounting element enabling front detention of the rack device when the rack device is installed in the thermal ducting rail, wherein the front detention secures a front edge of the rack device at a recessed position with respect to a front face of the rack chassis.

5. The thermal ducting rail of claim 4 , wherein the recessed position of the front edge of the rack device is within the front perforation.

6. The thermal ducting rail of claim 1 , wherein the front duct extends horizontally to a length corresponding to the front perforation.

7. The thermal ducting rail of claim 1 , wherein the thermal ducting rail is sized vertically for a unit height in the rack chassis, and wherein the front duct and the front perforation extend vertically to the unit height.

8. The thermal ducting rail of claim 7 , wherein the rear perforation extends vertically to the unit height.

9. A rack chassis, comprising:

a pair of thermal ducting rails for receiving a rack device that is separate from the pair of thermal ducting rails for installing, at respective sides of the rack device, the rack device into the pair of thermal ducting rails while the thermal ducting rails are installed in the rack chassis, at least one of the pair of thermal rails comprising:

a front perforation to receive cooling air from the environment from a front portion of the rack chassis, the front perforation located on the thermal ducting rail at a front portion of the thermal ducting rail;

a front duct to guide the cooling air received from the environment by the front perforation to an external side of the thermal ducting rail and along the external side of the thermal ducting rail toward a rear portion of the rack chassis, wherein the front duct is located at the external side of the thermal ducting rail and does not extend beyond the front portion of the thermal ducting rail; and

a rear perforation to:

receive the cooling air guided by said front duct along the external side of the thermal ducting rail at an internal side of the thermal ducting rail behind a rear face of a rack device that is separate from the thermal ducting rail and is installed in the thermal ducting rail; and

enable the cooling air to exit at the rear portion of the rack chassis behind the rear face of the rack device, the rear perforation located at a rear portion of the thermal ducting rail.

10. The rack chassis of claim 9 , at least one of the pair of thermal rails comprising:

a rear mounting element for the rack device, the rear mounting element enabling rear detention of the rack device when the rack device is installed in the pair of thermal ducting rails, and wherein the rear mounting element is adjustable along the thermal ducting rail.

11. The rack chassis of claim 10 , at least one of the pair of thermal rails comprising:

a spring included in the rear mounting element, the spring exerting forward force on the rack device when the rack device is installed in the pair of thermal ducting rails.

12. The rack chassis of claim 9 , at least one of the pair of thermal rails comprising:

a front mounting element for the rack device, the front mounting element enabling front detention of the rack device when the rack device is installed in the pair of thermal ducting rails, wherein the front detention secures a front edge of the rack device at a recessed position with respect to a front face of the rack chassis.

13. The rack chassis of claim 12 , wherein the recessed position of the front edge of the rack device is within the front perforation.

14. The rack chassis of claim 9 , wherein the front duct extends horizontally to a length corresponding to the front perforation.

15. The rack chassis of claim 9 , wherein the thermal ducting rail is sized vertically for a unit height in the rack chassis, and wherein the front duct and the front perforation extend vertically to the unit height.

16. The rack chassis of claim 15 , wherein the rear perforation extends vertically to the unit height.

17. The rack chassis of claim 9 , wherein the pair of thermal ducting rails are symmetrically equipped with respect to each other.

18. The thermal ducting rail of claim 1 , wherein the front portion of the thermal ducting rail comprising the front perforation is perpendicular to a front edge of the rack device when the rack device is installed in the thermal ducting rail.

19. The rack chassis of claim 9 , wherein the front portion of the thermal ducting rail comprising the front perforation is perpendicular to a front edge of the rack device when the rack device is installed in the pair of thermal ducting rails.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF REEL 034590 FRAME 0731 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0070 →
RELEASE OF REEL 034591 FRAME 0391 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040027/0719 →
RELEASE OF REEL 034590 FRAME 0696 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL PRODUCTS L.P.
Reel/Frame 040016/0964 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 034590/0696 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 034591/0391 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Dec 10, 2014
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 034590/0731 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2014
From: EMBLETON, STEVEN; SALAS, RENE JASON
To: DELL PRODUCTS L.P.
Reel/Frame 033939/0968 →
Continuity (1)
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