Material for Dissipating Heat From and/or Reducing Heat Signature of Electronic Devices and Clothing
A material for dissipating heat from and/or reducing the heat signature of electronic devices and clothing is disclosed. In one example, a heat-dissipating and/or heat signature-reducing layer is sandwiched between two substrates, wherein the substrates may be flexible, rigid, or a combination of both flexible and rigid. Further, examples of the heat-dissipating and/or heat signature-reducing layer include anti-static, anti-radio frequency (RF), anti-electromagnetic interference (EMI), anti-tarnish, and/or anti-corrosion materials.
1 . An article for dissipating heat comprising:
a. a heat-dissipating layer; and
b. one or more substrates disposed in close relation to the heat-dissipating layer.
2 . The article of claim 1 wherein the heat-dissipating layer comprises one or more of a material selected from the group consisting of an anti-static material, an anti-radio frequency material, an anti-electromagnetic interference material, an anti-corrosion material, or an anti-tarnish material.
3 . The article of claim 2 wherein the heat-dissipating layer comprises a copper shielding plastic.
4 . The article of claim 2 wherein the heat-dissipating layer comprises a copper impregnated polymer.
5 . The article of claim 1 comprising one substrate bonded to the heat-dissipating layer.
6 . The article of claim 1 comprising one substrate loosely arranged in relation to the heat-dissipating layer.
7 . The article of claim 1 comprising a first substrate and a second substrate, wherein the heat-dissipating layer is sandwiched between the first and second substrate.
8 . The article of claim 7 wherein the first and second substrates are bonded to the heat-dissipating layer.
9 . The article of claim 7 wherein the first and second substrates are loosely arranged in relation to the heat-dissipating layer.
10 . The article of claim 7 wherein the first substrate is bonded to the heat-dissipating layer and the second substrate is loosely arranged in relation to the heat-dissipating layer.
11 . The article of claim 1 wherein the one or more substrates are flexible, rigid, or a combination thereof.
12 . The article of claim 1 wherein the one or more substrates comprise a fabric.
13 . The article of claim 1 wherein the one or more substrates comprise one or more of a material selected from the group consisting of a glass, a plastic, and a metal.
14 . The article of claim 1 wherein the one or more substrates comprise multi-layer structures.
15 . The article of claim 2 wherein the article is configured to fit inside a hand-held radio holder.
16 . The article of claim 7 further comprising a solar panel assembly sandwiched between the first substrate and the heat-dissipating layer.
17 . The article of claim 16 wherein the solar panel assembly comprises multiple solar panels.
18 . The article of claim 16 wherein the first substrate comprises cut-outs configured to expose the solar panel assembly.
19 . The article of claim 16 further comprising an output connector electrically coupled to the solar panel assembly.
20 . The article of claim 16 wherein the article is foldable.