IP Library Granted Patent US 10,121,912
Granted Patent B2
US 10,121,912 · App. 14/519,486 · Granted Nov 6, 2018

High density capacitor integrated into focal plane array processing flow

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,121,912
App. No.
14/519,486
Granted
Nov 6, 2018
Kind
B2
Abstract

Methods and structures of photodetectors are described. The structure may include a readout integrated circuit substrate having an internally integrated capacitor. The structure may additionally include an external capacitor overlying the readout integrated circuit substrate. The external capacitor may be coupled with the internally integrated capacitor of the readout integrated circuit substrate, and configured to operate in parallel with the internally integrated capacitor of the readout integrated circuit substrate. The structure may also include a detector overlying the external capacitor.

Claims (19)

1. A photodetector structure comprising:

a readout integrated circuit substrate having an internally integrated capacitor;

an external capacitor overlying the readout integrated circuit substrate, wherein the external capacitor is coupled with the internally integrated capacitor of the readout integrated circuit substrate and configured to operate in parallel with the internally integrated capacitor of the readout integrated circuit substrate; and

a detector overlying the external capacitor.

2. The photodetector structure of claim 1 , further comprising a reflector material layer overlying the external capacitor, and located below the detector.

3. The photodetector structure of claim 2 , wherein the reflector material is configured to provide electrical coupling of an electrode of the external capacitor with the readout integrated circuit substrate.

4. The photodetector structure of claim 1 , wherein the detector comprises a photodiode.

5. The photodetector structure of claim 1 , wherein the external capacitor further comprises:

a first electrode overlying the readout integrated circuit substrate;

a dielectric material overlying the first electrode; and

a second electrode overlying the dielectric material.

6. The photodetector structure of claim 5 , wherein each of the first electrode and second electrode include a first layer of electrode material and a second layer of electrode material.

7. The photodetector structure of claim 6 , wherein the first layer of electrode material of the first electrode and the second layer of electrode material of the second electrode comprise the same material.

8. The photodetector structure of claim 6 , wherein the first electrode and the second electrode comprise a transition metal-containing material.

9. The photodetector structure of claim 5 , wherein the dielectric material comprises a transition metal-containing material or a poor metal-containing material.

10. The photodetector structure of claim 9 , wherein the dielectric material comprises at least two layers of dielectric material.

11. The photodetector structure of claim 10 , wherein the at least two layers of dielectric material comprise a different material in each layer.

12. The photodetector structure of claim 10 , wherein the dielectric material comprises at least three layers of material.

13. The photodetector structure of claim 12 , wherein each layer of dielectric material comprises a material different from the material directly over which it lies.

Assignments (1)
CHANGE OF NAME Recorded Mar 31, 2015
From: DRS RSTA, INC.
To: DRS NETWORK & IMAGING SYSTEMS, LLC
Reel/Frame 035349/0060 →