Coil-integrated printed circuit board and magnetic device
A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer.
1. A coil-integrated printed circuit board comprising:
a first outer layer which comprises a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside;
a first inner layer which comprises an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside; and
a second outer layer which comprises a second outer thick electric conductor made of a thick metallic foil and a second outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the second outer thick electric conductor, and which is exposed to an outside,
wherein coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor,
wherein a first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer,
wherein the first outer layer defines one of a top surface and a back surface of the coil-integrated printed circuit board, and the second outer layer defines the other of the top surface and the back surface,
wherein the first inner layer is disposed between the first outer layer and the second outer layer, and comprises the inner thick electric conductor without a thin electric conductor made of a thin metallic foil,
wherein the coil patterns are respectively formed by the first outer thick electric conductor, the second outer thick electric conductor and the inner thick electric conductor, and
wherein a second electronic component is surface-mounted on the second outer thin electric conductor.
2. The coil-integrated printed circuit board according to claim 1 , further comprising:
a second inner layer disposed between the first outer layer and the second outer layer, and which comprises an inner thin electric conductor without a thick electric conductor made of a thick metallic foil, and
wherein a wiring pattern is formed by the inner thin electric conductor.
3. A magnetic device comprising:
the coil-integrated printed circuit board according to claim 2 ; and
a core which is made of a magnetic material and which passes through the coil-integrated printed circuit board,
wherein the coil patterns formed in the coil-integrated printed circuit board are wound around the core.
4. A magnetic device comprising:
the coil-integrated printed circuit board according to claim 1 ; and
a core which is made of a magnetic material and which passes through the coil-integrated printed circuit hoard,
wherein the coil patterns formed in the coil-integrated printed circuit board are wound around the core.
5. A magnetic device comprising:
a coil-integrated printed circuit board; and
a core which is made of a magnetic material and which passes through the coil-integrated printed circuit board,
wherein the coil-integrated printed circuit board comprises:
a first outer layer which comprises a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and
a first inner layer which comprises an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside;
wherein coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor,
wherein a first electronic component other than the core is surface-mounted on the first outer thin electric conductor provided on the first outer layer,
wherein the coil patterns formed in the coil-integrated printed circuit board are wound around the core.