IP Library Granted Patent US 9,347,834
Granted Patent B2
US 9,347,834 · App. 14/520,563 · Granted May 24, 2016

Infrared sensor array based temperature monitoring systems for data centers and related methods

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Quick Facts
Patent No.
US 9,347,834
App. No.
14/520,563
Granted
May 24, 2016
Kind
B2
Abstract

Temperature monitoring systems for data centers include a plurality of ceiling-mounted infrared sensor arrays. Each infrared sensor array includes a two-dimensional array of infrared emission sensors, and at least some of the infrared emission sensors have field of view patterns that project onto aisle faces of equipment racks that are mounted in rows in the data center. These systems may further include a controller that is remote from at least some of the infrared sensor arrays and that is in communications with the infrared sensor arrays, the controller configured to provide a two-dimensional thermal map of the aisle faces of the equipment racks based at least in part on temperature data received from the infrared sensor arrays.

Claims (31)

1. A temperature monitoring system for a data center that includes a plurality of aisles and a plurality of equipment racks that are mounted in rows between the aisles, the temperature monitoring system comprising:

a plurality of overhead-mounted infrared sensor arrays that are mounted above the aisles and/or the equipment racks, wherein each infrared sensor array includes a two-dimensional array of infrared emission sensors, and at least some of the infrared emission sensors have field of view patterns that project onto aisle faces of the equipment racks; and

a controller that is remote from at least some of the infrared sensor arrays and that is in communications with the infrared sensor arrays, the controller configured to provide a two-dimensional thermal map of the aisle faces of the equipment racks based at least in part on temperature data received from the infrared sensor arrays,

wherein a first of the infrared sensor arrays comprises a substrate that has the plurality of infrared emission sensors on a front surface of the substrate, and wherein a back surface of the substrate is mounted at an acute angle with respect to a plane defined by the floor of the data center,

wherein a first of the overhead-mounted infrared sensor arrays comprises a ceiling-mounted infrared sensor array that is mounted on a support that extends downwardly below the ceiling,

wherein a first of the infrared sensor arrays is powered via a cable that includes at least first and second conductors, and wherein the information received from the first of the infrared sensor arrays is transmitted to the controller over at least one of the first and second conductors, and

wherein the first and second conductors of the cable provide a direct current power signal to a light fixture.

2. The temperature monitoring system of claim 1 , wherein the acute angle is an angle of at least twenty degrees.

3. The temperature monitoring system of claim 1 , wherein the overhead-mounted infrared sensor arrays are co-located with light fixtures that are mounted above the aisles.

4. The temperature monitoring system of claim 3 , wherein the controller is configured to control light emitted by the light fixtures based at least in part on motion detected by the overhead-mounted infrared sensor arrays.

5. The temperature monitoring system of claim 1 , wherein the infrared sensor arrays comprise Grid Pattern Infrared sensor arrays that detect infrared emissions and convert the detected infrared emissions to temperature values.

6. The temperature monitoring system of claim 1 , wherein the field of view pattern of the infrared emission sensors of a first of the overhead-mounted infrared sensor arrays have respective resolutions that vary at least as a function of a height of the field of view pattern above a floor of the data center.

7. The temperature monitoring system of claim 6 , wherein the respective resolutions increase with increasing height of the field of view pattern above the floor.

8. The temperature monitoring system of claim 1 , wherein a first infrared emission sensor of a first of the infrared sensor arrays has a field of view pattern that projects onto an upper portion of the aisle face of a first equipment rack, a second infrared emission sensor of the first of the infrared sensor arrays has a field of view pattern that projects onto a lower portion of the aisle face of the first equipment rack, and a third infrared emission sensor of the first of the infrared sensor arrays has a field of view pattern that projects onto a top surface of the first equipment rack.

9. The temperature monitoring system of claim 8 , wherein a fourth infrared emission sensor of the first of the infrared sensor arrays has a field of view pattern that projects onto a floor of the data center.

10. A temperature monitoring system for a data center that includes a plurality of aisles and a plurality of equipment that are mounted in rows between the aisles, the temperature monitoring system comprising:

a plurality of overhead-mounted infrared sensor arrays that are mounted above the aisles and/or the equipment racks, wherein each infrared sensor array includes a two-dimensional array of infrared emission sensors, and at least some of the infrared emission sensors have field of view patterns that project onto aisle faces of the equipment racks; and

a controller that is remote from at least some of the infrared sensor arrays and that is in communications with the infrared sensor arrays, the controller configured to provide a two-dimensional thermal map of the aisle faces of the equipment racks based at least in part on temperature data received from the infrared sensor arrays,

wherein a first infrared emission sensor of a first of the infrared sensor arrays has a field of view pattern that projects onto an upper portion of the aisle face of a first equipment rack and a second infrared emission sensor of the first of the infrared sensor arrays has a field of view pattern that projects onto a lower portion of the aisle face of the first equipment rack, and

wherein a third infrared emission sensor of the first of the infrared sensor arrays has a field of view pattern that projects onto a top surface of the first equipment rack.

11. The temperature monitoring system of claim 10 , wherein a fourth infrared emission sensor of the first of the infrared sensor arrays has a field of view pattern that projects onto a floor of the data center.

12. The temperature monitoring system of claim 11 , wherein the first through fourth infrared emission sensors have field of view patterns that are aligned along an axis.

13. The temperature monitoring system of claim 10 , wherein the field of view pattern of the infrared emission sensors of a first of the overhead-mounted infrared sensor arrays have respective resolutions that vary at least as a function of a height of the field of view pattern above a floor of the data center.

14. The temperature monitoring system of claim 13 , wherein the respective resolutions increase with increasing height of the field of view pattern above the floor.

15. The temperature monitoring system of claim 10 , wherein the infrared sensor arrays comprise Grid Pattern Infrared sensor arrays that detect infrared emissions and convert the detected infrared emissions to temperature values.

16. A temperature monitoring system for a data center that includes a plurality of aisles and a plurality of equipment racks that are mounted in rows between the aisles, the temperature monitoring system comprising:

a plurality of overhead-mounted infrared sensor arrays that are mounted above the aisles and/or the equipment racks, wherein each infrared sensor array includes a two-dimensional array of infrared emission sensors, and at least some of the infrared emission sensors have field of view patterns that project onto aisle faces of the equipment racks; and

a controller that is remote from at least some of the infrared sensor arrays and that is in communications with the infrared sensor arrays, the controller configured to provide a two-dimensional thermal map of the aisle faces of the equipment racks based at least in part on temperature data received from the infrared sensor arrays,

wherein the field of view pattern of the infrared emission sensors of a first of the overhead-mounted infrared sensor arrays have respective resolutions that vary at least as a function of a height of the field of view pattern above a floor of the data center.

17. The temperature monitoring system of claim 16 , wherein the respective resolutions increase with increasing height of the field of view pattern above the floor.

18. The temperature monitoring system of claim 16 , wherein the infrared sensor arrays comprise grid Pattern Infrared sensor arrays that detect infrared emissions and convert the detected infrared emissions to temperature values.

Assignments (9)
RELEASE OF SECURITY INTEREST AT REEL/FRAME 049905/0504 Recorded Dec 19, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: ARRIS ENTERPRISES LLC (F/K/A ARRIS ENTERPRISES, INC.); ARRIS TECHNOLOGY, INC.; ARRIS SOLUTIONS, INC.; COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; RUCKUS WIRELESS, LLC (F/K/A RUCKUS WIRELESS, INC.)
Reel/Frame 071477/0255 →
SECURITY INTEREST Recorded Nov 19, 2021
From: ARRIS SOLUTIONS, INC.; ARRIS ENTERPRISES LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE, INC. OF NORTH CAROLINA; RUCKUS WIRELESS, INC.
To: WILMINGTON TRUST
Reel/Frame 060752/0001 →
PATENT SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE TECHNOLOGIES LLC
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 049892/0051 →
ABL SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; ARRIS ENTERPRISES LLC; ARRIS TECHNOLOGY, INC.; RUCKUS WIRELESS, INC.; ARRIS SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 049892/0396 →
TERM LOAN SECURITY AGREEMENT Recorded Jul 3, 2019
From: COMMSCOPE, INC. OF NORTH CAROLINA; COMMSCOPE TECHNOLOGIES LLC; ARRIS ENTERPRISES LLC; ARRIS TECHNOLOGY, INC.; RUCKUS WIRELESS, INC.; ARRIS SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 049905/0504 →
MERGER AND CHANGE OF NAME Recorded Jan 21, 2019
From: REDWOOD SYSTEMS, INC.; COMMSCOPE TECHNOLOGIES LLC
To: COMMSCOPE TECHNOLOGIES LLC
Reel/Frame 048071/0412 →
RELEASE OF SECURITY INTEREST PATENTS (RELEASES RF 036201/0283) Recorded Mar 31, 2017
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: ALLEN TELECOM LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE, INC. OF NORTH CAROLINA; REDWOOD SYSTEMS, INC.
Reel/Frame 042126/0434 →
SECURITY INTEREST Recorded Jul 28, 2015
From: ALLEN TELECOM LLC; COMMSCOPE TECHNOLOGIES LLC; COMMSCOPE, INC. OF NORTH CAROLINA; REDWOOD SYSTEMS, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 036201/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2014
From: ADRIAENSSENS, LUC W; FINDLATER, STEWART
To: REDWOOD SYSTEMS, INC.
Reel/Frame 034062/0125 →