Methods to fabricate integrated circuits by assembling components
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. The present process can fabricate multiple components separately before assembling them into a complete integrated circuit. In an aspect, the ready-for-assembling components are taken directly from processed wafers without any additional assembling processes, and/or having lateral dimensions less than 1 mm.
1 . An integrated circuit comprising multiple functional components assembled together through bond pad connections, wherein at least a functional component has a lateral dimension less than 0.5 mm and a thickness less than 100 microns.
2 . An integrated circuit as in claim 1 wherein the multiple functional components are assembled using a photosensitive thermally decomposable polymer.
3 . An integrated circuit as in claim 1 wherein the multiple functional components are assembled using a thermal adhesion transfer process.
4 . An integrated circuit as in claim 1 wherein the multiple functional components are assembled in an at least partially stacked configuration.
5 . An integrated circuit as in claim 1 wherein the multiple functional components are assembled in an at least partially coplanar configuration.
6 . An integrated circuit as in claim 1 wherein the at least a functional component has a lateral dimension less than 0.1 mm.
7 . An integrated circuit as in claim 1 wherein at least two functional components are assembled close than 100 microns from each other.
8 . An integrated circuit as in claim 1 wherein at least a functional component comprises an integrated circuit.
9 . An integrated circuit as in claim 7 wherein the integrated circuit comprises a radio frequency identification (RFID) circuit.
10 . A radio frequency identification (RFID) circuit comprising a logic component, a memory component and a RF component assembled together through bond pad connections, wherein at least a component has a lateral dimension less than 1 mm and a thickness less than 100 microns.
11 . A RFID circuit as in claim 1 wherein the components are assembled using a photosensitive thermally decomposable polymer.
12 . A RFID circuit as in claim 1 wherein the components are assembled in an at least partially stacked configuration.
13 . A RFID circuit as in claim 1 wherein the components are assembled in an at least partially coplanar configuration.
14 . A RFID circuit as in claim 1 wherein the at least a component has a lateral dimension less than 0.1 mm.
15 . A RFID circuit as in claim 1 wherein the at least a component has a lateral dimension less than 0.5 mm.
16 . A RFID circuit as in claim 1 wherein at least two components are assembled close than 100 microns from each other.
17 . A RFID circuit as in claim 1 wherein the at least a component comprises a digital logic integrated circuit.
18 . A RFID circuit as in claim 1 wherein the RF component comprises an antenna having bond pads for connecting to the logic component.
19 . A RFID circuit as in claim 1 wherein the components are placed so that a first component face down on top of a second component so that the bond pads in the first component line up with the bond pads in the second component.
20 . A radio frequency identification (RFID) circuit comprising a logic component, and a RF component assembled together through bond pad connections, wherein at least one component has a lateral dimension less than 1 mm and a thickness less than 100 microns.