Foldable package structure
A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and the ultra-thin glass plate is disposed at one side of the predetermined folded region and stays away from the predetermined folded region.
1. A foldable package structure, for packaging at least one environmental-sensitive electronic component, the foldable package structure comprising:
a first laminated substrate, wherein the first laminated substrate comprises a first substrate, a first adhesive layer and at least two pieces of a first ultra-thin glass plate;
a second laminated substrate, disposed on one side of the first laminated substrate, wherein the second laminated substrate comprises a second substrate;
a second adhesive layer, disposed on the first laminated substrate and located between the first and second laminated substrates;
at least one environmental-sensitive electronic component, disposed on the second adhesive layer and located between the first and second laminated substrates; and
a third adhesive layer, disposed between the at least one environmental-sensitive electronic component and the second laminated substrate, wherein the foldable package structure comprises at least one predetermined folded region, the at least two pieces of the first ultra-thin glass plate are disposed respectively at two opposite sides of the at least one predetermined folded region but keep away from the at least one predetermined folded region.
2. The foldable package structure of claim 1 , wherein the first laminated substrate further comprises at least a reinforced barrier layer located between the two pieces of the first ultra-thin glass plate and located within the at least one predetermined folded region.
3. The foldable package structure of claim 1 , further comprising a sidewall barrier structure disposed between the first and second laminated substrates and located by at least one side of the at least one environmental-sensitive electronic component.
4. The foldable package structure of claim 1 , wherein a material of the first substrate or the second substrate comprises polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyether sulfone (PES), polyethylene naphthalate (PEN), cyclic olefin polymer (COP), or glass fiber reinforced plastics.
5. The foldable package structure of claim 1 , wherein the first laminated substrate or the second laminated substrate comprises a substrate, an ultra-thin glass plate and an adhesive layer.
6. The foldable package structure of claim 1 , wherein a material of the first adhesive layer, the second adhesive layer or the third adhesive layer comprises an optical adhesive, a thermosetting glue or a UV-curing glue.
7. The foldable package structure of claim 1 , wherein the at least one environmental-sensitive electronic component is an organic light-emitting diode (OLED) element, an electrophoretic display element, a liquid crystal display (LCD) element, an organic sensing element or a solar panel.
8. The foldable package structure of claim 1 , wherein the second laminated substrate comprises the second substrate, a fourth adhesive layer and at least two pieces of a second ultra-thin glass plate, the at least two pieces of the second ultra-thin glass plate are respectively disposed at two opposites sides of the at least one predetermined folded region but keep away from the at least one predetermined folded region.
9. The foldable package structure of claim 8 , wherein the second laminated substrate further comprises a reinforced barrier layer disposed between the at least two pieces of the second ultra-thin glass plate and located within the at least one predetermined folded region.
10. The foldable package structure of claim 8 , further comprising a sidewall barrier structure disposed between the first and second laminated substrates and located by at least one side of the at least one environmental-sensitive electronic component.
11. The foldable package structure of claim 8 , wherein a material of the fourth adhesive layer comprises an optical adhesive, a thermosetting glue or a UV-curing glue.
12. The foldable package structure of claim 8 , further comprising an intermediate barrier layer and the at least one environmental-sensitive electronic component is directly attached to the intermediate barrier layer, and the second and third adhesive layers sandwich the at least one environmental-sensitive electronic component and the intermediate barrier layer in-between.
13. A foldable package structure, comprising:
a first laminated substrate, wherein the first laminated substrate comprises a first substrate, a first adhesive layer and a first ultra-thin glass plate;
a second laminated substrate, disposed on an opposing side of the first laminated substrate, wherein the second laminated substrate comprises a second substrate;
a second adhesive layer, disposed on the first laminated substrate;
a first electronic component, disposed on the second adhesive layer and between the first and second laminated substrates, wherein the first electronic element is an environmental-sensitive electronic component;
a second electronic component, disposed on the second adhesive layer and between the first and second laminated substrates, wherein the second electronic component has an environmental-blocking requirement different from that of the first electronic component; and
a third adhesive layer, disposed between the first and second electronic components and the second laminated substrate, wherein the foldable package structure comprises at least one predetermined folded region, the first electronic component is arranged at one side of the at least one predetermined folded region, while the second electronic component is arranged at the other side of the at least one predetermined folded region, the first ultra-thin glass plate is arranged corresponding to the one side of the at least one predetermined folded region with the first electronic component and keeps away from the at least one predetermined folded region as well as the other side of the at least one predetermined folded region with the second electronic component.
14. The foldable package structure of claim 13 , wherein the first laminated substrate further comprises a reinforced barrier layer located in the at the least one predetermined folded region.
15. The foldable package structure of claim 13 , further comprising a sidewall barrier structure disposed between the first and second laminated substrates and located by at least one side of the at least one environmental-sensitive electronic component.
16. The foldable package structure of claim 13 , wherein a material of the first substrate comprises polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyether sulfone (PES), polyethylene naphthalate (PEN), cyclic olefin polymer (COP), or glass fiber reinforced plastics.
17. The foldable package structure of claim 13 , wherein the first laminated substrate or the second laminated substrate comprises a substrate, an ultra-thin glass plate and an adhesive layer.
18. The foldable package structure of claim 13 , wherein a material of the first adhesive layer, the second adhesive layer or the third adhesive layer comprises an optical adhesive, a thermosetting glue or a UV-curing glue.
19. The foldable package structure of claim 13 , wherein the at least one environmental-sensitive electronic component is an organic light-emitting diode (OLED) element, an electrophoretic display element, a liquid crystal display (LCD) element, an organic sensing element or a solar panel.
20. The foldable package structure of claim 13 , wherein the second laminated substrate comprises the second substrate, a fourth adhesive layer and a second ultra-thin glass plate, the second ultra-thin glass plate is arranged corresponding to the one side of the at least one predetermined folded region with the first electronic component but keeps away from the at least one predetermined folded region as well as the other side of the at least one predetermined folded region with the second electronic component.
21. The foldable package structure of claim 20 , wherein the second laminated substrate further comprises a reinforced barrier layer disposed within the at least one predetermined folded region.
22. The foldable package structure of claim 20 , wherein the second laminated substrate further comprises a sidewall barrier structure disposed between the first and second laminated substrates and surrounding the first electronic component.
23. The foldable package structure of claim 20 , wherein a material of the second substrate comprises polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyether sulfone (PES), polyethylene naphthalate (PEN), cyclic olefin polymer (COP), or glass fiber reinforced plastics.
24. The foldable package structure of claim 20 , wherein a material of the fourth adhesive layer comprises an optical adhesive, a thermosetting glue or a UV-curing glue.
25. The foldable package structure of claim 20 , further comprising an intermediate barrier layer and the at least one environmental-sensitive electronic component is directly attached to the intermediate barrier layer, and the second and third adhesive layers sandwich the at least one environmental-sensitive electronic component and the intermediate barrier layer in-between.