Hybrid wide-bandgap semiconductor bipolar switches
A hybrid semiconductor bipolar switch in which a normally-on high-voltage wide-bandgap semiconductor bipolar switch and a normally-off field effect transistor are connected in a cascode (Baliga-pair) configuration. The switch may be constructed as a stacked hybrid device where a discrete transistor is bonded on top of a bipolar switch. Power systems may use plural switches paired with anti-parallel diodes.
1. A stacked hybrid device comprising:
a transistor, the transistor being a normally-off silicon carbide field effect device comprising a source, a drain, and a gate of the transistor, the transistor being a discrete chip comprising a backside drain connection; and
a bipolar switch, the bipolar switch being a normally-on silicon carbide n-channel IGBT comprising an emitter, a collector, and a switch gate terminal, the bipolar switch comprising a top side emitter bonding pad and a backside collector connection;
wherein:
the backside drain connection is conductively bonded directly to the emitter bonding pad using a die attach material; and
the switch gate terminal is connected to the source, such that operation of the stacked hybrid device is controlled via the gate of the transistor.
2. The stacked hybrid device of claim 1 , further comprising an anti-parallel diode, wherein the anti-parallel diode comprises an anode and a cathode, the anode is connected to the source, and the cathode is connected to the collector.
3. The stacked hybrid device of claim 1 , wherein the transistor is a silicon carbide MOSFET.
4. The stacked hybrid device of claim 1 , wherein the transistor is a silicon carbide JFET.
5. A stacked hybrid device, comprising:
a transistor, the transistor being a normally-off silicon field effect device comprising a source, a drain, and a gate of the transistor, the transistor being a discrete chip comprising a backside drain connection; and
a bipolar switch, the bipolar switch being a normally-on silicon carbide n-channel IGBT comprising an emitter, a collector, and a switch gate terminal, the bipolar switch comprising a top side emitter bonding pad and a backside collector connection;
wherein:
the backside drain connection is conductively bonded directly to the emitter bonding pad using a die attach material; and
the switch gate terminal is connected to the source, such that operation of the stacked hybrid device is controlled via the gate of the transistor.
6. The stacked hybrid device of claim 5 , further comprising an anti-parallel diode, wherein the anti-parallel diode comprises an anode and a cathode, the anode is connected to the source, and the cathode is connected to the collector.
7. The stacked hybrid device of claim 5 , wherein the transistor is a silicon MOSFET.
8. The stacked hybrid device of claim 5 , wherein the transistor is a silicon JFET.