Method for mounting electronic component
View Patent ↗Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.
1. A method for mounting an electronic component having a plurality of board insert type leads on a board, the method comprising:
a providing process which provides a chuck unit including a fixed chuck member having a grip part and a movable chuck member having a grip part opposed to the grip part of the fixed chuck member;
a holding process which chucks only one of the plurality of leads of the electronic component by the chuck unit by moving the movable chuck member toward the fixed chuck member while the fixed chuck member is fixed, wherein any other ones of the plurality of leads of the electronic component are not chucked by the chuck unit in the holding process; and
an inserting process which inserts the leads of the electronic component held in the holding process respectively into lead insert holes provided in the board,
wherein the holding process comprises positioning one of the leads between the grip part of the movable chuck member and the grip part of the fixed chuck member, and chucking the one of the leads by moving the grip part of the movable chuck member toward the grip part of the fixed chuck member.
2. The method according to claim 1 , further comprising:
a recognizing process which recognizes the leads of the electronic component held by a mounting head; and
a recognition result obtaining process of obtaining a recognition result of the leads after the recognizing process, wherein
the leads of the electronic component are inserted into the lead insert holes in the inserting process based on the recognition result of the leads.
3. The method according to claim 2 , wherein
unchucked leads other than the lead chucked by the chuck unit are recognized in the recognizing process among the plurality of leads of the electronic component.
4. The method according to claim 1 , wherein
the plurality of leads include two leads, and an unchucked lead which is not chucked by the chuck unit is inserted into the lead insert hole prior to a lead which has been chucked by the chuck unit in the inserting process among the two leads provided in the electronic component.
5. The method according to claim 1 ,
further comprising positioning the chuck unit at a position offset by a predetermined amount from a center of the mounting head.
6. The method according to claim 1 , further comprising:
a pressing process which presses the electronic component, whose leads are inserted into the lead insert holes in the inserting process, toward a side of the board.
7. The method according to claim 6 , further comprising positioning the chuck unit at a position offset by a predetermined amount from a vertical central axis of a pressing unit used in the pressing process.
8. The method according to claim 1 ,
wherein when chucking the one of the plurality of leads of the electronic component, the movable chuck member moves toward the fixed chuck member in a direction perpendicular to a direction of extension of the one of the plurality of leads of the electronic component.