Counterbore Pocket Structure for Fluidic Assembly
A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.
1 . A fluidic assembly method using a counterbore pocket structure, the method comprising:
providing a substrate comprising a top surface and a bottom surface, with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface;
flowing an ink comprising a plurality of objects over the substrate top surface;
creating a suction pressure at the substrate bottom surface; and,
in response to the suction pressure from the through-holes, drawing the objects into the counterbore pocket structures.
2 . The method of claim 1 wherein flowing the ink over the substrate top surface includes flowing an ink comprising a plurality of objects in a shape of a disk.
3 . The method of claim 2 wherein providing the substrate includes providing counterbore pocket structures having a first diameter sliding fit to accommodate a disk diameter.
4 . The method of claim 2 wherein providing the substrate includes providing counterbore pocket structures having a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter.
5 . The method of claim 4 wherein providing the substrate includes providing the through-hole offset from the first diameter center, away from the second portion.
6 . The method of claim 2 wherein providing the substrate includes providing counterbore pocket structures having a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter.
7 . The method of claim 1 wherein flowing the ink over the substrate top surface includes:
arranging the substrate top surface with a substrate first side higher than a substrate second side;
introducing the ink to the substrate first side; and,
wherein drawing disks into the counterbore pocket structures includes drawings the disks in response to gravity as well as suction pressure.
8 . The method of claim 1 wherein providing the substrate includes providing a transparent substrate; and,
wherein flowing the ink over the substrate top surface includes flowing a plurality of light emitting diodes (LEDs) in the shape of a disk over the substrate top surface.
9 . A fluidic assembly substrate comprising:
a substrate comprising a top surface and a bottom surface;
a plurality of counterbore pocket structures formed in the substrate top surface; and,
a through-hole formed between each counterbore pocket structure and the substrate bottom surface.
10 . The fluidic assembly substrate of claim 9 wherein the substrate comprises:
a first layer with through-hole,s formed between a first layer top surface and a first layer bottom surface; and,
a second layer with counterbore pocket structure formed between a second layer top surface and a second layer bottom surface.
11 . The fluidic assembly substrate of claim 9 wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter.
12 . The fluidic assembly substrate of claim 11 wherein the through-hole is offset from the first diameter center, away from the second portion.
13 . The fluidic assembly substrate of claim 9 wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter.
14 . The fluidic assembly substrate of claim 9 wherein the substrate is transparent.
15 . A substrate assembly comprising:
a substrate comprising a top surface and a bottom surface;
a plurality of counterbore pocket structures formed in the substrate top surface;
a through-hole formed between each counterbore pocket structure and the substrate bottom surface; and,
an object at least sliding fit positioned inside each counterbore pocket structure.
16 . The substrate assembly of claim 15 wherein the objects are disks; and,
wherein the counterbore pocket structures have a first diameter sliding fit to accommodate a disk diameter.
17 . The substrate assembly of claim 15 wherein the objects are disks; and,
wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter.
18 . The substrate assembly of claim 17 wherein the through-hole is offset from the first diameter center, away from the second portion.
19 . The substrate assembly of claim 15 wherein the objects are disks; and,
wherein the counterbore, pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter.
20 . The substrate assembly of claim 15 wherein the substrate is transparent; and,
wherein the objects are light emitting diodes (LEDs) in the form of disks.