Transistor, method of manufacturing the transistor, semiconductor unit, method of manufacturing the semiconductor unit, display, and electronic apparatus
View Patent ↗A method of manufacturing a transistor includes: forming an oxide semiconductor film and a gate electrode on a substrate, the oxide semiconductor film having a channel region, and the gate electrode facing the channel region; and forming an insulating film covering the gate electrode and the oxide semiconductor film. Infiltration of moisture from the insulating film into the oxide semiconductor film is suppressed by the substrate.
1. A transistor comprising:
an oxide semiconductor film and a gate electrode on a substrate, the oxide semiconductor film having a channel region, and the gate electrode facing the channel region; and
an insulating film covering the gate electrode and the oxide semiconductor film,
wherein infiltration of moisture from the insulating film into the oxide semiconductor film is suppressed by the substrate,
wherein a retention capacitor shearing the oxide semiconductor film with the transistor is included.
2. A display provided with a display device and a transistor driving the display device, the transistor comprising:
an oxide semiconductor film and a gate electrode on a substrate, the oxide semiconductor film having a channel region, and the gate electrode facing the channel region; and
an insulating film covering the gate electrode and the oxide semiconductor film,
wherein infiltration of moisture from the insulating film into the oxide semiconductor film is suppressed by the substrate, and
wherein a retention capacitor shearing the oxide semiconductor film with the transistor is included.
3. An electronic apparatus with a display, the display provided with a display device and a transistor driving the display device, the transistor comprising:
an oxide semiconductor film and a gate electrode on a substrate, the oxide semiconductor film having a channel region, and the gate electrode facing the channel region; and
an insulating film covering the gate electrode and the oxide semiconductor film,
wherein infiltration of moisture from the insulating film into the oxide semiconductor film is suppressed by the substrate, and
wherein a retention capacitor shearing the oxide semiconductor film with the transistor is included.
4. A transistor comprising:
a gate electrode;
an oxide semiconductor film having a channel region that faces the gate electrode;
an etching protection film, at least a part of the etching protection film being in contact with the oxide semiconductor film;
an oxide film covering the gate electrode and the etching protection film, the oxide film being in contact with the oxide semiconductor film between the gate electrode and the etching protection film; and
source-drain electrodes electrically connected to the etching protection film through a through-hole of the oxide film.
5. The transistor according to claim 4 , further comprising a low resistance region in a part of the oxide semiconductor film, the part being in contact with the oxide film.
6. The transistor according to claim 4 , wherein the etching protection film contains one of a molybdenum film, an aluminum film containing neodymium, and indium tin oxide (ITO).
7. A semiconductor unit provided with a transistor, the transistor comprising:
a gate electrode;
an oxide semiconductor film having a channel region that faces the gate electrode;
an etching protection film, at least a part of the etching protection film being in contact with the oxide semiconductor film;
an oxide film covering the gate electrode and the etching protection film, the oxide film being in contact with the oxide semiconductor film between the gate electrode and the etching protection film; and
source-drain electrodes electrically connected to the etching protection film through a through-hole of the oxide film.
8. A display provided with a display device and a transistor driving the display device, the transistor comprising:
a gate electrode;
an oxide semiconductor film having a channel region that faces the gate electrode;
an etching protection film, at least a part of the etching protection film being in contact with the oxide semiconductor film;
an oxide film covering the gate electrode and the etching protection film, the oxide film being in contact with the oxide semiconductor film between the gate electrode and the etching protection film; and
source-drain electrodes electrically connected to the etching protection film through a through-hole of the oxide film.