Conformal thermal ground planes
A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.
1. A conformal heat pipe system comprising:
a circuit board;
a plurality of components on the circuit board, wherein the plurality of components include:
a first component with at least a first height with respect to the circuit board or a first shape;
a second component with a second height with respect to the circuit board or a second shape, wherein at least the second height or the second shape is different from at least the first height or the first shape; and
a third component with at least the second height with respect to the circuit board or the second shape;
a first conformal containment layer;
a second conformal containment layer, wherein the first conformal containment layer and the second conformal containment layer each includes a plurality of kinked portions forming a plurality of angled corners such that a first portion of the second conformal containment layer makes contact with the first component with at least the first height or the first shape and a second portion of the second conformal containment layer makes contact with the second component with at least the second height or the second shape and a third portion of the second conformal containment layer makes contact with the third component with at least the second height or the second shape, wherein the plurality of kinked portions include at least four kinked portions that each form 90 degree angles such that at least a first kinked portion from the plurality of kinked portions of the second conformal containment layer and a second kinked portion from the plurality of kinked portions of the second conformal containment layer separate the first portion of the second conformal containment layer and the second portion of the second conformal containment layer and at least a third kinked portion from the plurality of kinked portions of the second conformal containment layer and a fourth kinked portion from the plurality of kinked portions of the second conformal containment layer separate the first portion of the second conformal containment layer and the third portion of the second conformal containment layer;
a conformal vapor cavity disposed between the first conformal containment layer and the second conformal containment layer; and
a conformal liquid cavity disposed between the first conformal containment layer and the second conformal containment layer, wherein the conformal liquid cavity includes a working fluid.
2. The conformal heat pipe system according to claim 1 , wherein the first conformal containment layer, the second conformal containment layer, the conformal vapor cavity, and the conformal liquid cavity are coupled together as layers or cavities prior to being shaped into respective conformal shapes.
3. The conformal heat pipe system according to claim 1 , wherein the conformal liquid cavity comprises a wicking structure.
4. The conformal heat pipe system according to claim 1 , wherein the conformal liquid cavity comprises at least one of channels, micro pillars, and a mesh.
5. A conformal heat pipe system comprising:
a circuit board;
a plurality of components on the circuit board, wherein the plurality of components include:
a first component with at least a first height with respect to the circuit board or a first shape;
a second component with at least a second height with respect to the circuit board or a second shape, wherein at least the second height or the second shape is different from at least the first height or the first shape; and
a third component with at least the second height with respect to the circuit board or the second shape;
a first conformal containment layer having at least a first conformal feature formed within the first conformal containment layer;
a second conformal containment layer having at least a second conformal feature formed within the second conformal containment layer, wherein the second conformal feature is similar to the first conformal feature and wherein the first conformal feature and the second conformal feature each includes a plurality of kinked portions forming a plurality of angled corners such that a first portion of the second conformal containment layer makes contact with the first component with at least the first height or the first shape and a second portion of the second conformal containment layer makes contact with the second component with at least the second height or the second shape and a third portion of the second conformal containment layer makes contact with the third component with at least the second height or the second shape, wherein the plurality of kinked portions include at least four kinked portions that each form 90 degree angles such that at least a first kinked portion from the plurality of kinked portions of the second conformal containment layer and a second kinked portion from the plurality of kinked portions of the second conformal containment layer separate the first portion of the second conformal containment layer and the second portion of the second conformal containment layer and at least a third kinked portion from the plurality of kinked portions of the second conformal containment layer and a fourth kinked portion from the plurality of kinked portions of the second conformal containment layer separate the first portion of the second conformal containment layer and the third portion of the second conformal containment layer;
a conformal vapor cavity disposed between the first conformal containment layer and the second conformal containment layer having a third conformal feature that is similar to the first conformal feature; and
a conformal liquid cavity disposed between the first conformal containment layer and the second conformal containment layer having a fourth conformal feature that is similar to the first conformal feature, wherein the conformal liquid cavity includes a working fluid.
6. The conformal heat pipe system according to claim 5 , wherein the first conformal containment layer and/or the second conformal containment layer have a thickness less than 200 microns.
7. The conformal heat pipe system according to claim 5 , wherein the conformal vapor cavity and/or the conformal liquid cavity have a substantially consistent thickness.
8. The conformal heat pipe system according to claim 5 , wherein the conformal liquid cavity comprises a wicking structure.
9. The conformal heat pipe system according to claim 5 , wherein the conformal liquid cavity comprises at least one of channels, micro pillars, and a mesh.