Systems and methods for frequency generation

1. A circuit for frequency sampling using an integrated dielectric resonator oscillator (DRO), comprising:

a first input coupled to receive a first satellite signal at a first satellite downlink frequency;

a second input coupled to receive a second satellite signal at a second satellite downlink frequency;

a first analog-to-digital converter having an input coupled to receive the first satellite signal and an output, the first analog-to-digital converter configured to operate at a sampling rate at least twice the first satellite downlink frequency, and further configured to create a first digital output signal representing the first satellite signal;

a second analog-to-digital converter having an input coupled to receive the second satellite signal and an output, the second analog-to-digital converter configured to operate at a sampling rate at least twice the second satellite downlink frequency, and further configured to create a second digital output representing the second satellite signal;

a dielectric resonator oscillator having an output; and

a clock generator circuit having an input coupled to the oscillator output and configured to output one or more clocks used by the first and second analog-to-digital converters;

wherein the first and second analog-to-digital converters are implemented as part of an integrated circuit and a resonator element of the dielectric resonator oscillator is mounted on the substrate of the integrated circuit.

2. The frequency sampling circuit of claim 1 , wherein the integrated circuit comprises a flip-chip IC, the flip-chip IC comprising a substrate and a die.

3. The frequency sampling circuit of claim 2 , wherein the dielectric resonator oscillator comprises:

a dielectric resonator;

a transmission line disposed on the substrate of the flip chip and extending adjacent the dielectric resonator; and

active elements coupled to the transmission line and integrated with the die of the flip chip.

4. The frequency sampling circuit of claim 3 , wherein the active elements comprise:

an active device having an input electrically connected to the transmission line; and

a matching network having an input electrically connected to an output of the active device and an output configured to be connected to a load.

5. The frequency sampling circuit of claim 3 , wherein the dielectric resonator is mounted on the substrate of the flip-chip IC.

6. The frequency sampling circuit of claim 3 , wherein the flip-chip IC is mounted on a printed circuit board and the dielectric resonator is mounted on the printed circuit board adjacent the flip-chip IC.

7. The frequency sampling circuit of claim 6 , wherein the transmission line disposed on the substrate of the flip chip and extending adjacent the dielectric resonator extends to the printed circuit board adjacent the dielectric resonator.

8. The frequency sampling circuit of claim 3 , wherein the dielectric resonator comprises dielectric material configured as a cylindrical disk.

9. The frequency sampling circuit of claim 2 , wherein the transmission line is positioned sufficiently close to the dielectric resonator to form part of a resonant circuit with the dielectric resonator.

10. The frequency sampling circuit of claim 2 , wherein the clock generator circuit comprises at least one of a frequency multiplier and an frequency divider to provide the one or more clocks used by the first and second analog-to-digital converters at frequencies different from that output by the dielectric resonator oscillator.

11. A dielectric resonator oscillator, comprising:

a dielectric resonator;

a transmission line disposed adjacent the dielectric resonator;

an active device having an input electrically connected to the transmission line;

a matching network having an input electrically connected to an output of the active device and an output configured to be connected to a load; and

wherein both the transmission line and the active device are positioned sufficiently close to the dielectric resonator to form part of a resonant circuit with the dielectric resonator.

12. The dielectric resonator oscillator of claim 11 , wherein the dielectric resonator is disposed directly on a substrate of a flip chip.

13. The dielectric resonator oscillator of claim 11 , wherein the dielectric resonator is coupled to the transmission line and the active device without a direct connection.

14. The dielectric resonator oscillator of claim 11 , further comprising a second transmission line disposed adjacent the dielectric resonator.

15. The dielectric resonator oscillator of claim 11 , wherein the active device comprises a Si-bipolar transistor, GaAs FET, or CMOS transistor.

16. The dielectric resonator oscillator of claim 11 , wherein the transmission line is a microstrip line, and the dielectric resonator is coupled to the transmission line and the active device without a direct connection.

17. A dielectric resonator oscillator integrated with a flip-chip IC comprising a substrate and a die, the dielectric resonator oscillator comprising:

a dielectric resonator;

a transmission line disposed on the substrate of the flip chip and extending adjacent the dielectric resonator; and

an active device integrated with the die of the flip chip and having an input electrically connected to the transmission line;

wherein the transmission line is positioned sufficiently close to the dielectric resonator to form part of a resonant circuit with the dielectric resonator.

18. The dielectric resonator oscillator of claim 17 , further comprising a matching network integrated with the die of the flip chip having an input electrically connected to an output of the active device and an output configured to be connected to a load.

19. The dielectric resonator oscillator of claim 17 , wherein the dielectric resonator is mounted on the substrate of the flip-chip IC.

20. The dielectric resonator oscillator of claim 17 , wherein the flip-chip IC is mounted on a printed circuit board and the dielectric resonator is mounted on the printed circuit board adjacent the flip-chip IC.

21. The dielectric resonator oscillator of claim 20 , wherein the transmission line disposed on the substrate of the flip chip and extending adjacent the dielectric resonator extends to the printed circuit board adjacent the dielectric resonator.

22. The dielectric resonator oscillator of claim 17 , wherein the dielectric resonator comprises dielectric material configured as a cylindrical disk.