Laser fiber array for singulating semiconductor wafers

1. An apparatus for cutting a substrate, the apparatus comprising:

first and second lasers: and

first and second optical fibers, each having an input end and an output end opposite to the input end, the input ends of the first and second optical fibers being connected to the first and second lasers respectively;

one or more additional lasers and one or more optical fibers having input ends connected respectively to the one or more additional lasers, such that a combined output from the optical fibers forms a horizontal array of laser spots along a cutting line of the substrate; and

a controller system configured to selectively activate or deactivate each laser such that operation of one laser is independent from another laser;

wherein the output ends of the first, second and one or more additional optical fibers are movable relative to the substrate and are configured to image first, second and one or more additional laser beams onto the substrate simultaneously for cutting the substrate,

wherein the apparatus is configured to switch off a laser spot of the horizontal array that extends beyond an edge of the substrate in use,

wherein the first laser generates a laser beam of a different wavelength or at a different frequency from that generated by the second laser, and

wherein the first laser is an infrared laser and the second laser is an ultraviolet laser.

2. The apparatus as claimed in claim 1 , wherein the controller system includes.

3. The apparatus as claimed in claim 1 , wherein the laser beam output from the first and second lasers are merged and focused onto different points on the substrate at the same time via a lens assembly.

4. The apparatus as claimed in claim 1 , further comprising an objective lens assembly having a dual-wavelength anti-reflection coating for imaging laser beams generated from the lasers onto the substrate.

5. The apparatus as claimed in claim 1 , wherein the combined output from the optical fibers forms a linear array of laser spots on the substrate.

6. The apparatus as claimed in claim 1 , wherein the first laser comprises the same type of laser as the second laser.

7. The apparatus as claimed in claim 6 , wherein the first and second lasers comprise DPSS q-switch lasers.

8. The apparatus as claimed in claim 1 , wherein an output of the first and/or second laser is further divided into multiple split laser beams, each of the multiple split laser beams being coupled to a separate optical fiber.

9. The apparatus as claimed in claim 8 , further comprising an optical fiber coupling assembly comprising at least a beam splitter and a mirror,

wherein each of the separate optical fibers is attached to the optical fiber coupling assembly for receiving each of the multiple split laser beams.

10. The apparatus as claimed in claim 1 , further comprising a fixture to which the output ends of the optical fibers are secured for fixing the relative positions of the output ends of the optical fibers relative to each other.

11. The apparatus as claimed in claim 10 , wherein the fixture contains:

a plurality of grooves arranged in a generally planar orientation, and

a cover configured to secure the output ends of the optical fibers into the grooves to prevent further relative movement thereof.