Three-dimensional neural probe microelectrode array and method of manufacture
A three-dimensional neural probe electrode array system is described. Planar probes are microfabricated and electrically connected to flexible micro-machined ribbon cables using a rivet bonding technique. The distal end of each cable is connected to a probe with the proximal end of the cable being customized for connection to a printed circuit board. Final assembly consists of combining multiple such assemblies into a single structure. Each of the two-dimensional neural probe arrays is positioned into a micro-machined platform that provides mechanical support and alignment for each array. Lastly, a micro-machined cap is placed on top of each neural electrode probe and cable assembly to protect them from damage during shipping and subsequent use. The cap provides a relatively planar surface for attachment of a computer controlled inserter for precise insertion into the tissue.
1. A method for manufacturing a neural probe electrode assembly, the method comprising:
providing a platform workpiece comprising a sidewall and having a thickness extending between spaced apart upper and lower face walls, wherein an oxide layer resides in the platform workpiece between the upper and lower face walls and is sandwiched between a first silicon layer and a second silicon layer;
providing an upper mask on the upper face wall and a lower mask on the lower face wall, wherein the upper and lower masks provide respective upper and lower perimeters outlining a shape of a slot to be provided through the thickness of the platform workpiece, wherein the slot is configured to receive a neural probe array;
etching from the upper face wall partway through the thickness of the platform workpiece to the oxide layer to thereby provide an upper portion of the slot bounded by and spaced from the sidewall; and
etching from the lower face wall a remaining portion of the thickness of the platform workpiece including the oxide layer to thereby provide a finished platform having a lower portion of the slot bounded by and being spaced from the sidewall, wherein the finished platform has the upper and lower portions of the slot in open communication with each other to provide the slot extending to the upper and lower platform surfaces.
2. The method of claim 1 including providing the oxide layer extending to the sidewall.
3. The method of claim 1 including providing the oxide layer being from about 0.5 to 1 μm thick.
4. The method of claim 1 wherein the first silicon layer has a thickness of about 100 μm and the second silicon layer has a thickness of about 400 μm.
5. The method of claim 1 including providing the slot having a first slot portion in open communication with a second slot portion, and wherein the first slot portion has a greater width than the second slot portion, but a lesser depth perpendicular to the width than the second slot portion.
6. The method of claim 5 including providing at least two slots through the thickness of the platform workpiece, each of the at least two slots supporting a neural probe array, and wherein the at least two slots are parallel or not parallel to each other.
7. The method of claim 6 including providing the neural probe array comprising at least one electrode shank extending distally from a bond plate, and wherein the shank supports at least one electrode.
8. The method of claim 7 including providing the bond plate supporting at least one first bond pad electrically connected to the at least one electrode.
9. The method of claim 8 including providing at least one first bond pad supported on the bond plate being physically and electrically connected to a second bond pad at a distal end of an electrical cable.
10. The method of claim 9 including providing the first bond pad being physically and electrically connected to the second bond pad by a rivet.
11. The method of claim 10 wherein with the neural probe array received in each of the at least two slots, a rivet connecting the first bond pad on the bond plate to the second bond pad at the distal end of the electrical cable resides in the depth of the second slot portion.
12. A method for manufacturing a neural probe electrode assembly, the method comprising:
providing a platform workpiece comprising a sidewall and having a thickness extending between spaced apart upper and lower face walls, an oxide layer disposed in the platform workpiece between the upper and lower face walls;
providing an upper mask on the upper face wall and a lower mask on the lower face wall, wherein the upper and lower masks provide respective upper and lower perimeters defining at least two slots to be provided through the thickness of the platform workpiece, each of the at least two slots is configured to receive a neural probe array, wherein the slots are parallel or not parallel to each other;
etching from the upper face wall partway through the thickness of the platform workpiece to the oxide layer to thereby provide an upper portion of the slots spaced from the sidewall; and
etching from the lower face wall a remaining portion of the thickness of the platform workpiece including the oxide layer to thereby provide a finished platform having a lower portion of the slots spaced from the sidewall, wherein the finished platform has the upper and lower portions of each of the at least two slots in open communication with each other to provide the slots extending to the upper and lower platform surfaces.
13. The method of claim 12 , wherein the two slots are aligned at an angle other than 180° with respect to each other.
14. The method of claim 12 , wherein the finished platform comprises at least one protrusion extending laterally from the sidewall.
15. The method of claim 12 , including providing the neural probe array comprising at least one electrode shank extending distally from a bond plate, and wherein the shank supports at least one electrode.
16. The method of claim 15 , including providing the bond plate supporting at least one first bond pad electrically connected to the at least one electrode.
17. The method of claim 16 , including providing at least one first bond pad supported on the bond plate being physically and electrically connected to a second bond pad at a distal end of an electrical cable.
18. The method of claim 17 , including providing the first bond pad being physically and electrically connected to the second bond pad by a rivet.
19. The method of claim 18 , wherein with the neural probe array received in one of the slots, a rivet connects the first bond pad on the bond plate to the second bond pad at the distal end of the electrical cable.