IP Library Granted Patent US 9,746,249
Granted Patent B2
US 9,746,249 · App. 14/538,816 · Granted Aug 29, 2017

Heat pipe structure

Inventor: Sung-Wei Lee (New Taipei, TW)
Assignee: Asia Vital Components Co., Ltd.
F28D15/046F28D15/0233
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,746,249
App. No.
14/538,816
Granted
Aug 29, 2017
Kind
B2
Abstract

A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first receiving space. A first working fluid is contained in the first receiving space. The second tubular body is disposed in the first receiving space. The second tubular body has a second receiving space. A second working fluid is contained in the second receiving space. The solidification temperature of the first working fluid is different from the solidification temperature of the second working fluid so that the heat pipe structure can be activated at low temperature to keep operating at normal temperature to enhance the performance. Moreover, the assembly applicability is enhanced to lower the assembling cost.

Claims (13)

1. A heat pipe structure comprising:

a first closed tubular body having an internal first receiving space, a first working fluid being contained in the first receiving space, two ends of the first receiving space being respectively two first closed ends;

a second closed tubular body completely contained in the first receiving space in contact with and surrounded by said first working fluid, the second tubular body having an internal second receiving space, a second working fluid being contained in the second receiving space, two ends of the second receiving space being respectively two second closed ends;

a third tubular body disposed in the first receiving space, the third tubular body having a third receiving space, a third working fluid being contained in the third receiving space, two ends of the third receiving space being respectively two third closed ends;

wherein the third closed ends are formed in the first receiving space and connected with the first closed ends;

wherein the second and third tubular body's exterior surfaces are abutting each other; and

wherein the solidification temperature of the first working fluid is lower than the solidification temperature of the second working fluid, so that the heat pipe structure can be activated at low temperature to keep operating at normal temperature.

2. The heat pipe structure as claimed in claim 1 , wherein the second closed ends are formed in the first receiving space and connected with the first closed ends.

3. The heat pipe structure as claimed in claim 1 , further comprising a first capillary structure disposed on inner wall face of the first tubular body, the first capillary structure being selected from a group consisting of sintered powder body, channeled body, mesh body and coating.

4. The heat pipe structure as claimed in claim 1 , further comprising a second capillary structure disposed on inner wall face of the second tubular body, the second capillary structure being selected from a group consisting of sintered powder body, channeled body, mesh body and coating.

5. The heat pipe structure as claimed in claim 1 , wherein the third tubular body further has a third capillary structure disposed on inner wall face of the third tubular body, the third capillary structure being selected from a group consisting of sintered powder body, channeled body, mesh body and coating.

6. The heat pipe structure as claimed in claim 5 , wherein the third working fluid is one of pure water and methyl alcohol.

7. The heat pipe structure as claimed in claim 1 , wherein the first working fluid is one of pure water and methyl alcohol, while the second working fluid is the other of pure water and methyl alcohol.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2014
From: LEE, SUNG-WEI
To: ASIA VITAL COMPONENTS CO., LTD.
Reel/Frame 034150/0007 →
Continuity (1)
Related Publication 20160131435A1 · May 12, 2016