Thin film transistor substrate
View Patent ↗A thin film transistor substrate is disclosed, which comprises: a substrate; and plural thin film transistor units disposed on the substrate and respectively comprising: an active layer disposed on the substrate and made of polysilicon; an insulating layer disposed on the active layer; and a source electrode and a drain electrode disposed on the insulating layer, wherein the insulating layer comprises a first region corresponding to the active layer and a second region corresponding to a region outside the active layer, and a roughness of the first region is larger than that of the second region.
1. A thin film transistor substrate, comprising:
a substrate; and
plural thin film transistor units disposed on the substrate and respectively comprising:
an active layer disposed on the substrate and made of polysilicon;
a first insulating layer disposed on the active layer; and
a source electrode and a drain electrode disposed on the first insulating layer,
wherein the first insulating layer comprises a first region corresponding to the active layer and a second region corresponding to a region outside the active layer, and a roughness of a top surface of the first region is greater than a roughness of a top surface of the second region,
wherein the thin film transistor units further respectively comprise a metal layer disposed on the first insulating layer and a second insulating layer disposed on the metal layer, wherein the metal layer has plural first protrusions at a top surface of the metal layer, wherein the second insulating layer comprises a third region corresponding to the first region and a fourth region corresponding to the second region, and wherein a roughness of a top surface of the third region is greater than a roughness of a top surface of the fourth region.
2. The thin film transistor substrate as claimed in claim 1 , wherein the first insulating layer has plural second protrusions at the top surface of the first region of the first insulating layer.
3. The thin film transistor substrate as claimed in claim 2 , wherein the first region of the first insulating layer has a second thickness, the second protrusions respectively have a second height which is a distance between a top end of the second protrusion and the top surface of the first region of the first insulating layer, and the second height of the second protrusions is 30% to 70% of the second thickness of the first region the first insulating layer.
4. The thin film transistor substrate as claimed in claim 1 , wherein the first insulating layer has plural second protrusions, and a region of the first protrusions of the metal layer correspond to a region of the second protrusions of the first insulating layer.
5. The thin film transistor substrate as claimed in claim 1 , wherein the active layer has a side, and a curvature of the first insulating layer corresponding to the side of the active layer is less than that of the side of the active layer.
6. A thin film transistor substrate, comprising:
a substrate; and
plural thin film transistor units disposed on the substrate and respectively comprising:
an active layer disposed on the substrate and made of polysilicon;
a first insulating layer disposed on the active layer; and
a source electrode and a drain electrode disposed on the first insulating layer,
wherein the first insulating layer has plural second protrusions at a top surface of the first insulating layer, wherein the thin film transistor units further respectively comprise a metal layer disposed on the first insulating layer and a second insulating layer disposed on the metal layer, wherein the metal layer has plural first protrusions at a top surface of the metal layer, wherein the second insulating layer comprises a third region corresponding to the active layer and a fourth region corresponding to a region outside the active layer, and wherein a roughness of a top surface of the third region is greater than a roughness of a top surface of the fourth region.
7. The thin film transistor substrate as claimed in claim 6 , wherein the first insulating layer has a region having a second thickness, the second protrusions respectively have a second height which is a distance between a top end of the second protrusion and a top surface of the region of the first insulating layer, and the second height of the second protrusions is 30% to 70% of the second thickness of the region of the first insulating layer.
8. The thin film transistor substrate as claimed in claim 6 , wherein the metal layer has a region having a first thickness, the first protrusions respectively have a first height which is a distance between a top end of the first protrusion and a top surface of the region of the metal layer, and the first height of the first protrusion is 10% to 30% of the first thickness of the region of the metal layer.
9. The thin film transistor substrate as claimed in claim 6 , wherein a region of the first protrusions of the metal layer correspond to a region of the second protrusions of the first insulating layer.
10. The thin film transistor substrate as claimed in claim 6 , wherein the first insulating layer comprises a first region corresponding to the active layer and a second region corresponding to a region outside the active layer, and a roughness of a top surface of the first region is greater than a roughness of a top surface of the second region.
11. The thin film transistor substrate as claimed in claim 6 , wherein the active layer has a side, and a curvature of the first insulating layer corresponding to the side of the active layer is less than that of the side of the active layer.