IP Library Granted Patent US 9,948,274
Granted Patent B2
US 9,948,274 · App. 14/541,180 · Granted Apr 17, 2018

Surface acoustic wave device

Inventors: Keiichi Umeda (Nagaokakyo, JP); Ryo Nakagawa (Nagaokakyo, JP); Atsushi Tanaka (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
H03H9/02543H01L41/047H01L41/16H03H9/0296H03H9/02574
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Quick Facts
Patent No.
US 9,948,274
App. No.
14/541,180
Granted
Apr 17, 2018
Kind
B2
Abstract

A surface acoustic wave device includes a high acoustic velocity film in which a transversal wave propagates at a higher acoustic velocity than in a ScAlN film laminated on a substrate made of silicon or glass. The ScAlN film is laminated on the high acoustic velocity film, and IDT electrodes are laminated on the ScAlN film.

Claims (12)

1. A surface acoustic wave device comprising:

a substrate made of silicon or glass;

a scandium-containing aluminum nitride film provided on the substrate;

a high acoustic velocity film configured such that a transversal wave propagates at a higher acoustic velocity than in the scandium-containing aluminum nitride film and which is laminated between the substrate and the scandium-containing aluminum nitride film; and

an IDT electrode provided on the scandium-containing aluminum nitride film.

2. The surface acoustic wave device according to claim 1 , wherein the substrate, the scandium-containing aluminum nitride film, the high acoustic velocity film, and the IDT electrode are configured such that a Sezawa wave is used as a surface acoustic wave.

3. The surface acoustic wave device according to claim 1 , wherein the high acoustic velocity film is made of aluminum nitride or boron aluminum nitride.

4. The surface acoustic wave device according to claim 1 , further comprising a silicon oxide film that is laminated between the scandium-containing aluminum nitride film and the high acoustic velocity film.

5. The surface acoustic wave device according to claim 1 , wherein the substrate is a single-crystal silicon substrate.

6. The surface acoustic wave device according to claim 1 , wherein a normalized film thickness of the scandium-containing aluminum nitride film is within a range of about 0.6 to about 0.9.

7. The surface acoustic wave device according to claim 1 , wherein the substrate, the scandium-containing aluminum nitride film, the high acoustic velocity film, and the IDT electrode are configured such that a Rayleigh wave is used as a surface acoustic wave.

8. The surface acoustic wave device according to claim 1 , wherein the scandium-containing aluminum nitride film is disposed directly on a surface of the high acoustic velocity film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2014
From: UMEDA, KEIICHI; NAKAGAWA, RYO; TANAKA, ATSUSHI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 034183/0148 →
Priority Claims (1)
JP 2012-113171 · May 17, 2012 · national
Continuity (2)
Continuation PCTJP2013063078 · May 9, 2013
Related Publication 20150069882A1 · Mar 12, 2015