Substrate insert molding with deposited light-generating sources
Disclosed herein are technologies related to film-insert molding (FIM) with deposited light-generating sources, such as printed light-emitting diodes. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
1. A method of substrate insert molding (SIM), the method comprising:
positioning a light substrate between a top mold and a bottom mold, the top mold and the bottom mold being made of a material including polycarbonates and acrylics, the light substrate including:
a film substrate defining a plane and having a tail extending therefrom in the plane defined by the film substrate, the film substrate and the tail formed of a single continuous piece of a non-conductive material,
a light-generating source having electronically conductive circuitry, the light-generating source being attached to the film substrate, and
a trace extending along the tail from the film substrate and configured to connect the circuitry of the light-generating source to a power source;
depositing a light-transmissive material in between the top mold and the bottom mold so as to cover at least a portion of the light substrate; and
fusing the top mold, the bottom mold, the light substrate, and the light-transmissive material together;
wherein the tail protrudes out from between the fused top mold and bottom mold in the plane defined by the film substrate and is void of any hole around the tail.
2. A method according to claim 1 , wherein the fusing includes heating and pressing.
3. A method according to claim 1 , wherein the light-transmissive material mechanically bonds with the light substrate during the fusing.
4. A method according to claim 1 , wherein the light-transmissive material includes a thermoplastic resin.
5. A method according to claim 1 , wherein the light-transmissive material includes a thermoplastic resin selected from a group consisting of polycarbonates and acrylics.
6. A method according to claim 1 , wherein the light-transmissive material includes pigments therein.
7. A method according to claim 1 , wherein the light-transmissive material includes phosphor therein.
8. A method according to claim 1 , further comprising including a diffusing layer on one side of the light substrate.
9. A method according to claim 1 , wherein the light substrate includes a plurality of light-generating sources organized into a plurality of light-generating groups.
10. A method according to claim 1 , wherein the light-generating source is a light-emitting semiconductor.
11. A method according to claim 1 , wherein the light-generating source has a cross-section with a maximum length of 3 to 50 microns.
12. An electronic product sealed against liquid ingress in accordance with a method comprising:
positioning a light substrate between a top mold and a bottom mold, the top mold and the bottom mold being made of a material including polycarbonates and acrylics, the light substrate including:
a film substrate defining a plane and having an interface tail extending therefrom in the plane defined by the film substrate, the film substrate and the interface tail formed of a single continuous piece of a non-conductive material;
light-generating sources having electronically conductive circuitry, the light-generating sources deposited on the film substrate, and
a trace extending along the interface tail from the film substrate and configured to connect the light-generating sources to an external power source;
exposing a portion of the interface tail outside an area of the top mold and the bottom mold;
depositing a light-transmissive thermoplastic material in between the top mold and the bottom mold, thereby covering at least a portion of the light substrate in the light-transmissive thermoplastic material; and
fusing the top mold, the bottom mold, the light substrate, and the light-transmissive thermoplastic material together;
wherein the interface tail protrudes out from between the fused top mold and bottom mold in the plane defined by the film substrate and is void of any hole around the tail.
13. The method according to claim 1 , wherein the light-generating source is a light emitting diode (LED).
14. The method according to claim 12 , wherein the light-generating sources include light emitting diodes (LEDs).
15. The method according to claim 12 , wherein the light-transmissive material includes diffusing properties.
16. An apparatus, comprising:
a light substrate including:
a film substrate defining a plane and having a tail extending therefrom in the plane defined by the film substrate, the film substrate and the tail formed of a single continuous piece of a non-conductive material,
a conductive trace deposited directly onto the film substrate, the conductive trace extending along the tail from the film substrate,
light-generating sources deposited onto the conductive trace deposited directly onto the film substrate, wherein the conductive trace extending along the tail from the film substrate is configured to connect the light-generating sources to a power supply;
a top mold disposed vertically above the light substrate;
a bottom mold disposed vertically beneath the light substrate; and
light-transmissive material disposed adjacent the light substrate, the light-transmissive material covering at least a portion of the light substrate,
wherein the top mold and the bottom mold are made of a material including polycarbonates and acrylics, and
wherein the light substrate, the top mold, the bottom mold, and the light-transmissive material are fused together;
wherein the tail protrudes out from between the fused top mold and bottom mold in the plane defined by the film substrate and is void of any hole around the tail.
17. The apparatus according to claim 16 , wherein the light-generating sources include light emitting diodes (LEDs).