Semiconductor device including an H-bridge circuit for driving a motor
A semiconductor device includes a control section, a first arm, and a second arm; and has an H-bridge circuit to supply an input current supplied from a power source to an output terminal as a reversible electric current on the basis of a control signal outputted from the control section and a reverse-connection-time backflow prevention circuit to prevent an electric current in a direction opposite to the direction of the input current from being supplied to the H-bridge circuit. The first arm is formed over a first island. The second arm is formed over a second island. The control section and the reverse-connection-time backflow prevention circuit are formed over a third island.
1. A semiconductor device including an H-Bridge circuit for driving a motor, comprising:
a first semiconductor chip including a first P-MOSFET of the H-Bridge circuit;
a second semiconductor chip including a second P-MOSFET of the H-Bridge circuit;
a third semiconductor chip including a first N-MOSFET of the H-Bridge circuit;
a fourth semiconductor chip including a second N-MOSFET of the H-Bridge circuit;
a fifth semiconductor chip including a protection MOSFET which is coupled with the first N-MOSFET and the second N-MOSFET;
a control chip including a control circuit which controls the H-Bridge circuit and the protection MOSFET;
a first island over which the first semiconductor chip and the third semiconductor chip are mounted;
a second island over which the second semiconductor chip and the fourth semiconductor chip are mounted; and
a third island over which the control chip and the fifth semiconductor chip are mounted,
wherein the first P-MOSFET and the second P-MOSFET of the H-Bridge circuit are configured to couple with a positive terminal of a battery, and
wherein the protection MOSFET is configured to couple with a negative terminal of the battery.
2. The semiconductor device according to claim 1 , wherein
in response to a reverse-connection in which the positive terminal is coupled with the protection MOSFET and the negative terminal of the battery is coupled with the first P-MOSFET and the second P-MOSFET, the protection MOSFET is turned off.
3. The semiconductor device according to claim 1 , wherein
the protection MOSFET is a vertical N-type power MOSFET.
4. The semiconductor device according to claim 3 , wherein
a rear side of the fifth semiconductor chip acts as a drain of the protection MOSFET.
5. The semiconductor device according to claim 4 , wherein
the rear side of the fifth semiconductor chip is coupled with the third island.
6. The semiconductor device according to claim 4 , wherein
the protection MOSFET includes a parasitic diode, and
a source and the drain of the protection MOSFET act as an anode and a cathode of the parasitic diode.
7. The semiconductor device according to claim 1 , wherein
the semiconductor device is configured to be mounted on a mounting board.
8. The semiconductor device according to claim 7 , wherein
the first N-MOSFET and the protection MOSFET are coupled via a first wiring on the mounting board, and
the second N-MOSFET and the protection MOSFET are coupled via a second wiring on the mounting board.
9. A semiconductor device including an H-Bridge circuit for driving a motor, the semiconductor device including:
a first semiconductor chip including a first P-MOSFET of the H-Bridge circuit, the first P-MOSFET including a first gate, a first source, and a first drain;
a second semiconductor chip including a second P-MOSFET of the H-Bridge circuit, the second P-MOSFET including a second gate, a second source, and a second drain;
a third semiconductor chip including a first N-MOSFET of the H-Bridge circuit, the first N-MOSFET including a third gate, a third source, and a third drain;
a fourth semiconductor chip including a second N-MOSFET of the H-Bridge circuit, the second N-MOSFET including a fourth gate, a fourth source, and a fourth drain;
a fifth semiconductor chip including a vertical N-type power MOSFET that includes:
a fifth gate;
a fifth source coupled with the third source and the fourth source; and
a fifth drain that is a rear side of the fifth semiconductor chip;
a control chip including a control circuit which controls the first to fifth gates;
a first island over which the first semiconductor chip and the third semiconductor chip are mounted;
a second island over which the second P-MOSFET and the second N-MOSFET are mounted; and
a third island over which the control chip and the fifth semiconductor chip are mounted,
wherein the first source of the first P-MOSFET and the second source of the second P-MOSFET are configured to couple with a positive terminal of a battery, and
wherein the fifth drain of the vertical N-type power MOSFET is configured to couple with a negative terminal of the battery.
10. The semiconductor device according to claim 9 , wherein
in response to reverse-connection in which the positive terminal is coupled with the fifth drain of the vertical N-type power MOSFET and the negative terminal of the battery is coupled with the first source of the first P-MOSFET and the second source of the second P-MOSFET, the vertical N-type power MOSFET is turned off.
11. A semiconductor device, comprising:
a control section configured to output a control signal;
an H-bridge circuit configured to supply current, which is reversible based on the control signal, to a terminal; and
a reverse-connection-time backflow prevention circuit configured to prevent current supplied to the H-bridge circuit from flowing in a direction opposite to that of the current supplied to the terminal,
the control section and the reverse-connection-time backflow prevention circuit being disposed over a same island.