Output capacitance reduction in power transistors
View Patent ↗Technologies are described for reduction of an output capacitance of a transistor. In some examples, spacing of source-to-drain metallization may be increased and a sealed air-gap may be employed in an elongated trench in the drain region to reduce a dielectric constant of a portion of the body region and thereby the output capacitance of the transistor. In other examples, a planar area component of a body-drain junction may be reduced by forming a spherical cavity at a bottom portion of the body-drain junction and sealing the cavity with a low dielectric constant material. In further examples, a sealed cavity may be formed in an epitaxial region below the body region through formation and removal of selective buried oxide islands. In yet other examples, the output capacitance may be reduced through removal of areas in the drain region of the transistor that do not contribute to the current flow.
1. A semiconductor device, comprising:
a substrate;
an epitaxial layer in contact with a top surface of the substrate;
a drain layer in the substrate;
a body region within a top portion of the epitaxial layer;
a source region within a top portion of the body region;
a vertical gate structure substantially along at least one outer edge of the body region;
two trenches on opposite sides of the body region in the top portion of the epitaxial layer, the trenches filled with a dielectric material, wherein corners of at least one of the two trenches are rounded to lower a contribution of the body region to an output capacitance of the semiconductor device with a reduced effect on a current flow through the body region;
a conductive shield layer that substantially covers a top surface of the epitaxial layer and at least one of the two trenches;
an oxide layer in contact the conductive shield layer;
a dielectric layer in contact with the oxide layer;
one or more interlayer dielectric layers in contact with the dielectric layer; and
a contact layer, wherein a first portion of the contact layer is in contact with the vertical gate structure and a second onion of the contact layer is in contact with the source region and the shield layer.
2. The semiconductor device of claim 1 , wherein the corners of the at least one of the two trenches are rounded through removal of a portion of the epitaxial layer around the corners.
3. The semiconductor device of claim 1 , wherein the corners of the at least one of the two trenches are rounded through deposition of an oxide material to a portion of the epitaxial layer outside the corners.
4. A semiconductor device, comprising:
a substrate;
an epitaxial layer in contact with a top surface of the substrate;
a drain layer in the substrate;
a body region within a top portion of the epitaxial layer;
a source region within a top portion of the body region;
a vertical gate structure substantially along at least one outer edge of the body region;
two trenches on opposite sides of the body region in the top portion of the epitaxial layer, the trenches filled with a dielectric material, wherein corners of at least one of the two trenches are curved through removal of a portion of the epitaxial layer around the corners so as to lower a contribution of the body region to an output capacitance of the semiconductor device with a reduced effect on a current flow through the body region;
a conductive shield layer that substantially covers a top surface of the epitaxial layer and at least one of the two trenches;
an oxide layer in contact with the conductive shield layer;
a dielectric layer in contact with the oxide layer; and
a contact layer, wherein a first portion of the contact layer is in contact with the vertical gate structure and a second portion of the contact layer is in contact with the source region and the shield layer.
5. The semiconductor device of claim 4 , wherein a width of at least one of the two trenches is in a range from about 0.25 micrometers to about 0.5 micrometers.
6. The semiconductor device of claim 4 , wherein a depth of at least one of the two trenches is in a range from about 2 micrometers to about 8 micrometers.
7. The semiconductor device of claim 4 , wherein the semiconductor device comprises one of a lateral transistor, a lateral power transistor, a lateral radio frequency (RF) power transistor, or a lateral double-diffused metal oxide semiconductor (LDMOS).
8. A semiconductor device, comprising:
a substrate;
an epitaxial layer in contact with a top surface of the substrate;
a drain layer in the substrate;
a body region within a top portion of the epitaxial layer;
a source region within a top portion of the body region and electrically coupled to the body region;
a vertical gate structure substantially along at least one outer edge of the body region;
two trenches on opposite sides of the body region in the top portion of the epitaxial layer, the trenches filled with a dielectric material, wherein corners of at least one of the two trenches are curved through deposition of an oxide material to a portion of the epitaxial layer outside the corners so as to lower a contribution of the body region to an output capacitance of the semiconductor device with a reduced effect on a current flow through the body region;
a conductive shield layer that substantially covers a top surface of the epitaxial layer and at least one of the two trenches;
an oxide layer in contact with the conductive shield layer;
a dielectric layer in contact with the oxide layer;
one or more interlayer dielectric layers in contact with the dielectric layer; and
a contact layer, wherein a first portion of the contact layer is in contact with the vertical gate structure and a second portion of the contact layer is in contact with the source region and the shield layer.
9. The semiconductor device of claim 8 , further comprising a Rate contact configured to be electrically coupled to the vertical gate structure.
10. The semiconductor device of claim 9 , wherein the vertical gate structure includes at least two gate terminals disposed on the top portion of the epitaxial layer and is configured to control the current flow through the body region.
11. The semiconductor device of claim 8 , wherein at least one of the two trenches is formed by at least one of: a masked reactive-ion etch (RIE) process or TMAH-based anisotropic etch process.
12. The semiconductor device of claim 8 , wherein the semiconductor device comprises one of: a vertical transistor, a lateral transistor, a vertical gate shielded power transistor, or a lateral gate shielded power transistor.
13. The semiconductor device of claim 4 , further comprising one or more interlayer dielectric layers in contact with the dielectric layer.