IP Library Granted Patent US 9,544,988
Granted Patent B2
US 9,544,988 · App. 14/551,499 · Granted Jan 10, 2017

Boiling refrigerant type cooling system

Inventors: Kazuaki Suzuki (Hadano, JP); Shigemasa Sato (Hadano, JP); Akio Idei (Hadano, JP)
Assignee: HITACHI, LTD.
H05K1/0201F25B39/04H01L23/427H05K7/20318H01L2924/0002
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,544,988
App. No.
14/551,499
Granted
Jan 10, 2017
Kind
B2
Abstract

A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.

Claims (29)

1. A boiling refrigerant type cooling system comprising:

a heat reception jacket, attached to a heat generating body provided on a circuit board, that vaporizes a liquid contained inside by heat from the heat generating body;

a condenser that receives steam from the heat reception jacket and transmits heat to the outside so as to condense the steam to the liquid;

a first pipe that conducts the steam from the heat reception jacket to the condenser; and

a second pipe that conducts the liquid from the condenser to the heat reception jacket,

wherein the heat reception jacket comprises a boiling heat transfer unit which contacts the liquid and is in thermal contact with the heat generating body, and

wherein the boiling heat transfer unit comprises:

a plurality of parallel tunnels under a surface, wherein the plurality of parallel tunnels communicate with the outside via gaps,

a groove formed through the plurality of parallel tunnels, wherein the groove is closer than the plurality of parallel tunnels to the heat generating body, and

a cover plate on the groove.

2. The boiling refrigerant type cooling system according to claim 1 , wherein the groove is configured to be formed through the plurality of parallel tunnels in an orthogonal direction to the plurality of parallel tunnels.

3. The boiling refrigerant type cooling system according to claim 2 ,

wherein the groove is configured to be formed through middle of the boiling heat transfer unit.

4. A boiling refrigerant type cooling system comprising:

a heat reception jacket, attached to a heat generating body provided on a circuit board, which vaporizes a liquid contained inside by heat from the heat generating body;

wherein the heat reception jacket comprises a boiling heat transfer unit in thermal contact with the heat generating body, and

wherein the boiling heat transfer unit comprises:

a plurality of parallel tunnels, wherein the parallel tunnels communicate with the outside via gaps,

a groove formed through the plurality of parallel tunnels, wherein the groove is closer than the plurality of parallel tunnels to the heat generating body, and

a cover plate on the groove.

5. The boiling refrigerant type cooling system according to claim 4 , wherein the groove is configured to be formed through the plurality of parallel tunnels in an orthogonal direction to the plurality of parallel tunnels.

6. A boiling refrigerant type cooling system comprising:

a heat reception jacket, attached to a heat generating body provided on a circuit board, which vaporizes a liquid contained inside by heat from the heat generating body;

wherein the heat reception jacket comprises a boiling heat transfer unit in thermal contact with the heat generating body, and

wherein the boiling heat transfer unit comprises:

a plurality of parallel tunnels, wherein the parallel tunnels communicate with the outside via gaps,

a groove formed through the plurality of parallel tunnels, and

a cover plate on the groove.

7. The boiling refrigerant type cooling system according to claim 6 , wherein the groove is formed through the plurality of parallel tunnels in an orthogonal direction to the plurality of parallel tunnels.

Assignments (2)
COMPANY SPLIT Recorded Aug 20, 2024
From: HITACHI, LTD.
To: HITACHI VANTARA, LTD.
Reel/Frame 069518/0761 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2014
From: SUZUKI, KAZUAKI; SATO, SHIGEMASA; IDEI, AKIO
To: HITACHI, LTD.
Reel/Frame 034270/0995 →
Priority Claims (1)
JP 2011-131027 · Jun 13, 2011 · national
Continuity (2)
Continuation 13494461 · Jun 12, 2012
Related Publication 20150075200A1 · Mar 19, 2015