IP Library Granted Patent US 9,178,139
Granted Patent B2
US 9,178,139 · App. 14/552,024 · Granted Nov 3, 2015

Variable resistive memory device and method of fabricating the same

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Quick Facts
Patent No.
US 9,178,139
App. No.
14/552,024
Granted
Nov 3, 2015
Kind
B2
Abstract

Provided are a variable resistive memory device and a method of fabricating the same. The variable resistive memory device includes an interlayer insulating film having an opening therein, the opening exposing a surface of a first electrode which is disposed at a bottom of the opening. A variable resistive layer is formed in the opening and a second electrode is formed on the variable resistive layer. The variable resistive layer has a sidewall that is separated from an inner side surface of the opening to define a gap between the sidewall of the variable resistive layer and the inner side surface of the opening.

Claims (14)

1. A variable resistive memory device comprising:

an interlayer insulating film having an opening therein, the opening exposing a surface of a first electrode which is disposed at a bottom of the opening;

a variable resistive layer formed in the opening; and

a second electrode formed on the variable resistive layer,

wherein a sidewall of the variable resistive layer is separated from an inner side surface of the opening to define a gap between the sidewall of the variable resistive layer and the inner side surface of the opening.

2. The variable resistive memory device of claim 1 , wherein the first electrode is formed at the bottom of the opening.

3. The variable resistive memory device of claim 1 , wherein the variable resistive layer contacts a surface of the first electrode, except for a surface of a portion of the first electrode formed directly beneath the gap.

4. The variable resistive memory device of claim 1 , wherein the second electrode extends over a top surface of the interlayer insulating film to cover the gap.

5. The variable resistive memory device of claim 1 , wherein the gap is filled with oxygen, nitrogen, an inert gas, or a mixture thereof.

6. The variable resistive memory device of claim 1 , wherein the gap is evacuated.

7. The variable resistive memory device of claim 1 , wherein the variable resistive layer comprises a phase-change material layer.

8. The variable resistive memory device of claim 7 , wherein the phase-change material layer comprises a chalcogenide material.

9. The variable resistive memory device of claim 1 , further comprising a selection element positioned between any one of the first electrode and the second electrode and the variable resistive layer.

10. The variable resistive memory device of claim 1 , wherein the first electrode is coupled to a bit line or a word line, and the second electrode is coupled to the other one of the bit line or the word line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067335/0246 →