Electronic device comprising a chip of integrated circuits stacked with an optical plate
An electronic device is formed by a stack of an integrated circuit chip and an optical plate. The integrated circuit chip includes integrated circuits (such as optical circuits) formed on or in a semiconductor substrate plate. The optical integrated circuits may form an optical sensor. An electrical connection network is provided on the top side of the semiconductor substrate plate. Electrical connection lugs, which are connected to the electrical connection network through electrical connection vias, are mounted on the back side of the semiconductor substrate plate. The vias are through silicon vias situated at a distance from the periphery of the semiconductor substrate plate. The optical plate is configured to allow light radiation to pass to the optical integrated circuits.
1. An electronic device comprising, in a stack:
a chip of integrated circuits which comprises a substrate plate including an optical sensor and an electrical connection network, said substrate plate having, on a first side, first electrical connection lugs connected to the electrical connection network through electrical connection vias situated at a distance from a periphery of the substrate plate,
an optical plate configured to allow light radiation to pass, a rear surface of the optical plate being mounted to a second side of the chip opposite to the first side;
an encapsulation ring made of an opaque encapsulation material surrounding peripheries of said chip and said optical plate and contacting a portion of the rear surface of the optical plate; and
wherein the encapsulation ring has a front surface coplanar with a front surface of the optical plate and a rear surface coplanar with the first side.
2. The device according to claim 1 , wherein the electrical connection vias are formed through the substrate plate.
3. The device according to claim 1 , wherein the electrical connection vias are formed in a layer including said electrical connection network.
4. The device according to claim 1 , wherein the chip comprises a thinned substrate plate.
5. The device according to claim 1 , further comprising a printed circuit board equipped with second electrical connection lugs connected to the first electrical connection lugs.
6. The device according to claim 1 , wherein the substrate plate has a thickness equal to or less than 100 microns.
7. The device according to claim 1 , wherein the optical plate has a thickness equal to or less than 300 microns.
8. A device, comprising:
an integrated circuit chip including an optical circuit formed on a front side of a semiconductor substrate, an interconnection network layer formed on top of the front side of the semiconductor substrate, and a plurality of vias electrically connected to said interconnection network layer and extending through the semiconductor substrate to a back side;
a rear surface of an optical plate mounted to a front surface of said interconnection network layer;
an encapsulating body surrounding peripheries of the integrated circuit chip and optical plate and contacting a portion of the rear surface of the optical plate; and
wherein the encapsulating body has a front surface coplanar with a front surface of the optical plate and a rear surface coplanar with the back side of the integrated circuit chip.
9. The device of claim 8 , wherein the plurality of vias is positioned near a periphery of the semiconductor substrate.
10. The device of claim 8 , wherein the interconnection network layer includes electrical connection lines, but wherein said electrical connection lines are absent in optical alignment with the optical circuit.
11. The device of claim 8 , wherein the encapsulating body is formed of an opaque material.
12. The device of claim 8 , further comprising an electrical connection network formed on the back side of the integrated circuit chip.