IP Library Patent Application 14553770
Patent Application
App. No. 14/553,770

METHOD OF MAKING A FLOOR PANEL

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Quick Facts
Patent No.
US None
App. No.
14/553,770
Abstract

A method of making a floor panel includes the steps of: providing an adhesive on a release member; laminating or marrying the release member to a bottom layer such that the adhesive is between the release member and the bottom layer; removing a portion of the release member to expose an area of the adhesive; and adhering a top layer to the area such that the top layer is offset with respect to the bottom layer in a direction of length and width and a marginal end portion of a top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed.

Claims (22)

1 . A method of making a floor panel, comprising:

providing a floor panel having a top layer and a bottom layer, wherein the top layer and bottom layer are coupled together in an offset relationship such that a marginal end portion of the top surface of the bottom layer and a marginal end portion of a bottom surface of the top layer are exposed;

applying an adhesive on at least one of the top surface of the bottom layer or the bottom surface of the top layer such that the adhesive is exposed.

2 . The method of claim 1 , wherein the marginal end portions are substantially L-shaped.

3 . The method of claim 1 , wherein the adhesive is selected from: a pressure sensitive adhesive; a hot melt adhesive; a structural adhesive; and a reactive adhesive.

4 . The method of claim 1 , wherein the adhesive comprises a pressure sensitive acrylic adhesive.

5 . The method of claim 1 , further comprising the step of applying a release member to the marginal end portion of the top surface of the bottom layer or the marginal end portion of the bottom surface of the top layer.

6 . The method of claim 1 , wherein the top layer comprises a mix layer.

7 . The method of claim 1 , wherein the bottom layer is a film or tape comprising plastic, vinyl, polyvinyl chloride, polyester, polyolefin, or nylon.

8 . The method of claim 1 , wherein the bottom layer has a thickness less than a thickness of the top layer.

9 . The method of claim 1 , wherein a ratio of thickness of the top layer to a thickness of the bottom layer is about 5 or greater.

10 . The method of claim 9 , wherein the ratio of the thickness of the top layer to the thickness of the bottom layer is about 10-100.

11 . The method of claim 10 , wherein the ratio of the thickness of the top layer to the thickness of the bottom layer is about 10-25.

12 . The method of claim 1 , wherein the top layer has a length L 1 and width W 1 , and the bottom layer has a length L 2 and a width W 2 .

13 . The method of claim 12 , wherein L1=L2 and W1=W2.

14 . The method of claim 1 , wherein the top surface of the bottom layer or the bottom surface of the top layer is substantially smooth.

15 . The method of claim 1 , wherein the adhesive is applied by spraying, roll coating, or air knife coating.

16 . The method of claim 1 , wherein an assembly jig is used to couple the top layer to the top surface of the bottom layer.

17 . The method of claim 12 , wherein the bottom layer is cut from a continuous sheet, and wherein the adhesive is applied to the top surface of the bottom layer prior to the continuous sheet being cut.

18 . The method of claim 17 , wherein the bottom layer is formed by cutting the continuous sheet substantially perpendicular to a direction of tension of the bottom layer.

19 . The method of claim 18 , wherein the direction of tension of the bottom layer is substantially parallel to the width of the bottom layer.

20 . A floating flooring system comprising a plurality of floor panels prepared according to the method of claim 1 , wherein a marginal end portion having the adhesive is coupled to a marginal end portion of an adjacent floor panel.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Jul 26, 2022
From: BANK OF AMERICA, N.A.
To: ARMSTRONG FLOORING, INC.; AFI LICENSING LLC
Reel/Frame 060934/0566 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 47999 FRAME: 554. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jun 1, 2020
From: AFI LICENSING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 052804/0921 →
SECURITY INTEREST Recorded Jan 2, 2019
From: AFI LICENSING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 047999/0554 →
RELEASE OF SECURITY INTEREST Recorded Dec 31, 2018
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AFI LICENSING LLC
Reel/Frame 047996/0459 →
SECURITY INTEREST Recorded Oct 17, 2016
From: AFI LICENSING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 040381/0180 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2016
From: AWI LICENSING COMPANY
To: AFI LICENSING LLC
Reel/Frame 038629/0767 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2015
From: LEE, SHIH CHUNG
To: SHANGHAI JINKA FLOORING TECHNOLOGY CO., LTD
Reel/Frame 035457/0708 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2015
From: SHANGHAI JINKA FLOORING TECHNOLOGY CO., LTD
To: ARMSTRONG WORLD INDUSTRIES, INC.
Reel/Frame 035457/0759 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2015
From: BALMER, RICHARD H.; DAO, DUNG V.; ESHBACH, JOHN R., JR.; HARRINGTON, HEATH E.; BUCKWALTER, MICHAEL E.; ANSPACH, KEAN M.
To: ARMSTRONG WORLD INDUSTRIES, INC.
Reel/Frame 035457/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2015
From: ARMSTRONG WORLD INDUSTRIES, INC.
To: AWI LICENSING COMPANY
Reel/Frame 035475/0005 →