APAO-based hot melt adhesives
Ethylene-co-propylene-co-butene-1 terpolymers, made either with or without an in-reactor-added organosilicon external donor, are used in the formulation of improved-performance, APAO-based, hot melt adhesives.
1 . A hot-melt adhesive comprising:
a) an APAO terpolymer;
b) a tackifier;
c) a wax component;
d) a component selected from the group consisting of maleic anhydride grafted polyethylene waxes, maleic anhydride grafted polypropylene waxes, and low molecular weight polymers; and,
e) a liquid plasticizer.
2 . The hot-melt adhesive recited in claim 1 wherein the terpolymer has a melt viscosity of about 1000 cps to about 10,000 cps.
3 . The hot-melt adhesive recited in claim 1 wherein the tackifier comprises a partially hydrogenated synthetic hydrocarbon tackifier.
4 . The hot-melt adhesive recited in claim 1 wherein the tackifier comprises a fully hydrogenated synthetic hydrocarbon tackifier.
5 . The hot-melt adhesive recited in claim 1 wherein the low molecular weight polymers are grafted with maleic anhydride.
6 . The hot-melt adhesive recited in claim 1 wherein the wax component comprises a paraffinic wax.
7 . The hot-melt adhesive recited in claim 1 wherein the wax component comprises a metallocene wax.
8 . The hot-melt adhesive recited in claim 1 where in the liquid plasticizer comprises a mineral oil.
9 . The hot-melt adhesive recited in claim 1 where in the liquid plasticizer comprises paraffinic oil.
10 . The hot-melt adhesive recited in claim 1 wherein the APAO terpolymer is made in the presence of an externally-added organosilicon donor.
11 . The hot-melt adhesive recited in claim 10 wherein the externally-added organosilicon donor is cyclohexylmethyl dimethoxy silane.
12 . The hot-melt adhesive recited in claim 10 wherein the externally-added organosilicon donor is phenyl triethoxysilane.
13 . The hot-melt adhesive recited in claim 1 wherein the APAO terpolymer comprises at least one ethylene-co-propylene-co-butene-1 terpolymer.
14 . The hot-melt adhesive recited in claim 13 wherein the APAO terpolymer has a 1-butene content of between about 10% and about 25% by weight.
15 . The hot-melt adhesive recited in claim 13 wherein the APAO terpolymer has an ethylene content of between about 5% to about 20% by weight.
16 . The hot-melt adhesive recited in claim 13 wherein the APAO terpolymer has an ethylene content of between about 5% to about 10% by weight.
17 . The hot-melt adhesive recited in claim 1 wherein the APAO terpolymer consists of ethylene-co-propylene-co-butene-1 terpolymer.
18 . The hot-melt adhesive recited in claim 1 wherein the tackifier comprises a partially hydrogenated C 5 compound.
19 . The hot-melt adhesive recited in claim 1 wherein the tackifier comprises a fully hydrogenated C 5 compound.
20 . The hot-melt adhesive recited in claim 1 wherein the tackifier comprises a hydrogenated dicyclopentadiene-type resin.
21 . The hot-melt adhesive recited in claim 1 further comprising a hydrogenated styrene block copolymer.
22 . The hot-melt adhesive recited in claim 1 further comprising a polyethylene polymer.
23 . The hot-melt adhesive recited in claim 22 wherein the polyethylene polymer is a branched low density polymer having a melt index greater than about 500 dg/min.
24 . The hot-melt adhesive recited in claim 1 further comprising a metallocene polyethylene polymer.
25 . The hot-melt adhesive recited in claim 1 further comprising a metallocene polypropylene polymer.
26 . The hot-melt adhesive recited in claim 1 wherein the tackifier comprises between about 0 and about 25% by weight of the hot melt adhesive, the wax component comprises about 0 to about 15% by weight of the hot melt adhesive and the liquid plasticizer comprises between 0 to about 25% by weight of the hot melt adhesive.