IP Library Granted Patent US 9,787,270
Granted Patent B2
US 9,787,270 · App. 14/554,681 · Granted Oct 10, 2017

Overstress management for power amplifiers

Inventors: Baker Scott (San Jose, CA); George Maxim (Saratoga, CA); Dirk Robert Walter Leipold (San Jose, CA)
Assignee: Qorvo US, Inc.
H03G3/3036H03F1/0211H03F1/0272H03F1/223H03F1/32H03F1/523H03F1/565H03F3/19H03F3/193H03F3/45179H03F3/45394H03F3/68H04B1/0475H03F2200/324H03F2200/387H03F2200/451H03F2200/471H03F2201/3236H03G3/3042H04B2001/0408H04B2001/0416H04B2001/0425
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Quick Facts
Patent No.
US 9,787,270
App. No.
14/554,681
Granted
Oct 10, 2017
Kind
B2
Abstract

A power amplifier includes an amplifier element and overstress management circuitry coupled to the amplifier element. The overstress management circuitry is configured to detect an overstress condition of the amplifier element and adjust one or more operating parameters of the amplifier element in response to the detection of an overstress condition of the amplifier element. Using the overstress management circuitry prevents damage to the amplifier element that may occur due to uncorrected overstress conditions which may degrade or destroy a gate oxide of the amplifier element. Accordingly, the longevity of the amplifier element is improved.

Claims (46)

1. A power amplifier comprising:

an amplifier element configured to receive and amplify a radio frequency (RF) input signal to provide an RF output signal; and

overstress management circuitry comprising:

overstress sensor circuitry comprising a hot carrier injection (HCI) overstress sensor coupled to the amplifier element, the overstress sensor circuitry configured to:

detect an overstress condition of the amplifier element; and

produce an overstress indicator signal; and

overstress control circuitry coupled to the overstress sensor circuitry and configured to adjust one or more operating parameters of the amplifier element in response to the overstress indicator signal.

2. The power amplifier of claim 1 wherein the amplifier element is a transistor including a gate contact, a drain contact, a source contact, and a bulk contact.

3. The power amplifier of claim 2 wherein the overstress management circuitry comprises a capacitor coupled between the source contact and the drain contact of the transistor and configured to reduce a voltage between the gate contact and the source contact when a voltage above a predetermined threshold is present between the drain contact and the source contact.

4. The power amplifier of claim 1 wherein the overstress sensor circuitry comprises:

input filtering circuitry;

transfer function circuitry coupled to an output of the input filtering circuitry; and

output filtering circuitry coupled to an output of the transfer function circuitry.

5. The power amplifier of claim 4 wherein:

the input filtering circuitry is configured to receive an overstress measurement signal from the amplifier element and filter out high frequency components of the overstress measurement signal to produce a filtered overstress measurement signal;

the transfer function circuitry is configured to perform a non-linear signal transformation on the filtered overstress measurement signal to generate a transformed overstress measurement signal; and

the output filtering circuitry is configured to filter the transformed overstress measurement signal to generate the overstress indicator signal.

6. The power amplifier of claim 4 wherein the overstress sensor circuitry further comprises integrator circuitry coupled between the transfer function circuitry and the output filtering circuitry.

7. The power amplifier of claim 6 wherein:

the input filtering circuitry is configured to receive an overstress measurement signal from the amplifier element and filter out high frequency components of the overstress measurement signal to produce a filtered overstress measurement signal;

the transfer function circuitry is configured to perform a non-linear signal transformation on the filtered overstress measurement signal to generate a transformed overstress measurement signal;

the integrator circuitry is configured to receive and integrate the transformed overstress measurement signal to generate a transformed and integrated overstress measurement signal; and

the output filtering circuitry is configured to filter the transformed and integrated overstress measurement signal to generate the overstress indicator signal.

8. The power amplifier of claim 1 wherein the overstress control circuitry is configured to adjust a biasing voltage provided to the amplifier element in response to the overstress indicator signal.

9. The power amplifier of claim 1 wherein the overstress control circuitry is configured to adjust one of the RF input signal and the RF output signal in response to the overstress indicator signal.

10. The power amplifier of claim 1 wherein:

the RF input signal is provided to an input of the amplifier element and the RF output signal is provided at an output of the amplifier element; and

the overstress control circuitry is configured to adjust an impedance presented to the output of the amplifier element in response to the overstress indicator signal.

11. The power amplifier of claim 10 further comprising output waveform shaping circuitry configured to receive a control signal from the overstress control circuitry and adjust an LC harmonic trap circuit in response to the control signal.

12. The power amplifier of claim 2 wherein the overstress sensor circuitry is configured to measure a bulk current of the amplifier element.

13. The power amplifier of claim 1 wherein the overstress sensor circuitry further comprises a gate oxide integrity (GOI) overstress sensor.

14. The power amplifier of claim 13 wherein the overstress sensor circuitry is configured to measure a bulk current of the amplifier element and a voltage between one or more contacts of the amplifier element.

15. The power amplifier of claim 13 wherein the overstress sensor circuitry is configured to measure a root mean square (RMS) voltage between one or more contacts of the amplifier element.

16. The power amplifier of claim 13 wherein the overstress control circuitry is configured to adjust a biasing voltage provided to the amplifier element in response to the overstress indicator signal.

17. The power amplifier of claim 13 wherein the overstress control circuitry is configured to adjust an input signal provided to the amplifier element in response to the overstress indicator signal.

18. The power amplifier of claim 13 wherein the overstress control circuitry is configured to adjust an impedance at an output of the amplifier element in response to the overstress indicator signal.

19. A power amplifier comprising:

a plurality of amplifier elements configured to receive a radio frequency (RF) input signal at an input, amplify the RF input signal, and provide an RF output signal at an output; and

overstress management circuitry comprising:

overstress sensor circuitry comprising a hot carrier injection (HCI) overstress sensor coupled to the amplifier element, the overstress sensor circuitry configured to:

detect an overstress condition of the amplifier element; and

produce an overstress indicator signal; and

overstress control circuitry coupled to the overstress sensor circuitry and configured to:

adjust one or more operating parameters of the plurality of amplifier elements in response to the overstress indicator signal; and

adjust an impedance presented to the output of the plurality of amplifier elements in response to the overstress indicator signal.

20. The power amplifier of claim 19 wherein the overstress sensor circuitry further comprises a gate oxide integrity (GOI) overstress sensor.

Assignments (2)
MERGER Recorded Jun 16, 2016
From: RF MICRO DEVICES, INC.
To: QORVO US, INC.
Reel/Frame 039196/0941 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2015
From: SCOTT, BAKER; MAXIM, GEORGE; LEIPOLD, DIRK ROBERT WALTER
To: RF MICRO DEVICES, INC.
Reel/Frame 034751/0868 →
Continuity (2)
Provisional Application 61909028 · Nov 26, 2013
Related Publication 20150145594A1 · May 28, 2015